8
7
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INTEL(R) CELERON(TM) PROCESSOR (PPGA)/INTEL(R) 810 CHIPSET UNIPROCESSOR CUSTOMER REFERENCE SCHEMATICS REVISION 1.3 D
C
B
A
D
TITLE
PAGE
Cover Sheet Block Diagram 370-Pin Socket GTL Termination Clock Synthesizer GMCH Frame Buffer DIMM Sockets ICH0 FWH Super I/O PCI Connectors ATA33 IDE Connectors USB Connectors Parallel Port Serial/Game Ports Keyboard/Mouse/Floppy Disk Digital Video Out (TBD) Graphics Connectors AC’97 Riser Connector LAN System Voltage Regulators Processor Voltage Regulator System Pullup Resistors and Unused Gates Decoupling
1 2 3,4 5 6 7,8,9 10 11,12 13,14 15 16 17,18 19 20 21 22 23 24 25 26 27,28 29 30 31,32 33 34,35
** PLEASE NOTE THESE SCHEMATICS ARE SUBJECT TO CHANGE
TH ESE SC HEM AT IC S ARE PRO VIDED “AS IS” W ITH N O W ARRANT IES W HATSO EVER, INCLUDIN G ANY W AR RANT Y O F M ERCH ANT ABILIT Y, FIT NESS FO R ANY PART ICULAR PUR PO SE, O R ANY W ARR ANT Y O THERW ISE ARISING O UT O F PR O PO SAL, SPECIFIC AT IO N O R SAM PLES. Inform ation in this docum ent is provided in connection with Intel products. No license, express or im plied, by estoppel or otherwise, to any intellectual property rights is granted by this docum ent. Except as provided in Intel's T erm s and Conditions of Sale for such products, Intel assum es no liability whatsoever, and Intel disclaim s any express or im plied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, m erchantability, or infringem ent of any patent, copyright or other intellectual property right. Intel products are not intended for use in m edical, life saving, or life sustaining applications. Intel m ay m ake changes to specifications and product descriptions at any tim e, without notice. The Intel Celeron TM processor and Intel 810 chipset m ay contain design defects or errors known as errata which m ay cause the product to deviate from published specifications. Current characterized errata are available on request.
*Third-party brands and nam es are the property of their respective owners.
A
REV:
1.3
COVER SHEET DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
7
6
B
Copyright © Intel Corporation 1998.
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
8
C
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
1
OF
40
8
7
6
5
4
3
2
1
Block Diagram D
Device Table
D
VRM
370-Pin Socket Processor
Clock
DATA
CTRL
ADDR
DATA
CTRL
ADDR
Term
Display Cache Memory
2 DIMM Modules
GMCH Digital Video Out Device
C
IDE Primary
UltrA/33
PCI ADDR/DATA
USB
USB Port 2
LPC Bus
AMC’97 Audio/Modem
AC’97 Link
PCI CONN 3
ICH0 USB Port 1
PCI CONN 2
PCI CONN 1
PCI CNTRL IDE Secondary
PCI CNTRL PCI ADDR/DATA
LAN
B
SIO
REFERENCE DESIGNATOR U12 U16,U17 U15 U3 U1 U2 U14 U7 U13 U8,U9 U10 U6 U18 U4 U5 U11 VR2,VR3 VR4 VR1 VR5
DEVICE TYPE 74lvc14a gd75232 lpc47b27_a 74lvc06a ck-whitney 82810-DC100 82801AB sii-dfp 82559 1x16sdram 74lvc08a qst3384 93c46 74ls132 74lvc07a 74lvc07a lt1587ad lt1117_3 ltc1753 lt1585ad
SHEET NUMBER 32 22 16 29,32 6 7,8,9 13,14 24 27 10 32 25 27 29,32 29,31 19,31 29 29 30 29
GATES USED A,B,C,D
A,B,C,D
A,B
A,B A,B,C A,B,C
C
B
FirmWare Hub
Keyboard
Floppy
Parallel
Game Conn
Mouse Serial 1
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
BLOCK DIAGRAM DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:43 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
2
OF
40
8
7
6
2
1
HD#31
C5
HD#32
F6
HD#33
C1
HD#34
C7
HD#35
B2
HD#36
C9
HD#37
A9
HD#38
D8
HD#39
D10
HD#40
C15
HD#41
D14
HD#42
D12
HD#43
A7
HD#44
A11
HD#45
C11
HD#46
A21
HD#47
A15
HD#48
A17
HD#49
C13
HD#50
C25
HD#51
A13
HD#52
D16
HD#53
A23
HD#54
C21
HD#55
C19
HD#56
C27
HD#57
A19
HD#58
C23
HD#59
C17
HD#60
A25
HD#61
A27
HD#62
E25
HD#63
F16
V32
Z32
AH32
AM32
B30
F30
AK34
D28
AJ29
AM28
F26
D24
AJ25
AM24
F22
D20
AJ21
AM20
B18
E17
AJ17
AM16
B14
E13
AJ13
AM12
B10
E9
AJ9
AM8
B6
D6
AJ5
F2
J5
N5
S5
W5
AA5
AE5
AM4
E5
F4
K2
P2
T2
AB2
AF2
AK2
C3
B26
R32 VCC52
VCC51
VCC50
VCC49
VCC48
VCC47
VCC46
VCC45
VCC44
VCC43
VCC42
VCC41
VCC40
VCC39
VCC38
VCC37
VCC36
VCC35
VCC34
VCC33
VCC32
VCC31
VCC30
VCC29
VCC28
VCC27
VCC26
VCC25
VCC24
VCC23
VCC22
VCC21
VCC20
VCC19
VCC18
VCC17
VCC16
VCC15
VCC14
VCC13
VCC12
VCC11
VCC10
VCC9
VCC8
VCC7
VCC6
VCC5
VCC4
VCC3
HA#30
HD#29
HA#31
HD#30 HD#31
VID0
HD#32
VID1
HD#33
VID2
HD#34
VID3
HD#35 RS#0
HD#36
RS#1
HD#37
RS#2
HD#38 HD#39
REQ#0
HD#40
REQ#1
HD#41
REQ#2
HD#42
REQ#3
HD#43
REQ#4
HD#44 RSRVD1
HD#45
RSRVD2
HD#46
RSRVD3
HD#47
RSRVD4
HD#48
RSRVD5
HD#49
RSRVD6
HD#50
RSRVD7
HD#51
RSRVD8
HD#52
RSRVD9
HD#53
RSRVD10
HD#54
RSRVD11
HD#55
RSRVD12
HD#56
RSRVD13
HD#57
RSRVD14
HD#58
RSRVD15
HD#59
RSRVD16
HD#60
RSRVD17
HD#61 HD#62 HD#63
GND50
HD#30
J3
HA#29
HD#28
GND49
A3
HD#27
GND48
HD#29
HA#28
GND47
A5
HA#27
GND46
HD#28
HD#26
GND45
HD#27
HA#26
Part 1
HD#25
GND44
E1 F12
GND43
E3
HD#26
HA#25
HD#24
GND42
K6
GND41
HD#24
HA#24
HD#23
GND40
G3
HA#23
GND39
HD#23
370-Pin Socket
HD#22
GND38
F8
HA#22
GND37
HD#22
HD#21
GND36
G1
HA#21
HD#20
GND35
HD#21
HD#19
GND34
L3
HA#20
GND33
HD#20
HA#19
HD#18
GND32
HD#19
H6
GND31
P4
HA#18
HD#17
GND30
HD#18
HD#16
GND29
R4
HA#17
GND28
HD#17
HA#16
HD#15
GND27
HD#16
H4
GND26
U3
HA#15
HD#14
GND25
HD#15
HA#14
HD#13
GND24
N3
HD#12
GND23
HD#14
HA#13
GND22
L1
HA#12
HD#11
GND21
HD#13
HA#11
HD#10
GND20
Q1
HA#10
HD#9
GND19
M4
HD#12
HD#8
GND18
Q3
HD#11
HA#9
GND17
HD#10
HD#7
GND16
P6
HA#8
GND15
HD#9
HA#7
HD#6
GND14
HD#8
S1
HD#5
GND13
J1
HA#6
GND12
T6
HD#7
HA#5
HD#4
GND11
HD#6
HA#4
GND10
HD#5
S3
HA#[31:3]
HA#3
GND9
A
3
HD#3
GND8
U1
HD#25
B
4
HD#2
GND7
HD#4
HD#1
GND6
M6
GND5
N1
HD#3
GND4
HD#2
VCC2
T4
VCC1
HD#1
HD#0
GND3
C
W1
GND2
D
X2 HD#0
GND1
HD#[63:0]
RSRVD18
AK8
5,7
HA#3
AH12
HA#4
AH8
HA#5
AN9
HA#6
AL15
HA#7
AH10
D
HA#8
AL9
HA#9
AH6
HA#10
AK10
HA#11
AN5
HA#12
AL7
HA#13
AK14
HA#14
AL5
HA#15
AN7
HA#16
AE1
HA#17
Z6
HA#18
AG3
HA#19
AC3
HA#20
AJ1
HA#21
AE3
HA#22
AB6
HA#23
AB4
HA#24
AF6
HA#25
Y3
HA#26
AA1
HA#27
AK6
HA#28
Z4
HA#29
AA3
HA#30
AD4
HA#31
AL35
VID0
AM36
VID1
AL37
VID2
C
VID[3:0]
AJ37
VID3
AH26
RS#0
AH22
RS#1
RS#[2:0]
AK28
RS#2
AK18
HREQ#0
AH16
HREQ#1
AH18
HREQ#2
AL19
HREQ#3
AL17
HREQ#4
30
7
HREQ#[4:0]
7
B
AH20 AH4 A29 A31 A33 AA33 AA35 AC1 AC37 AF4 AK16 AK24 AK30 AL11 AL13 AL21
A
AN11 AN13
REV:
D30
AM30
B28
F28
D26
AJ27
AM26
B24
F24
D22
AJ23
B20
AM22
F20
E19
AJ19
AM18
B16
E15
AJ15
AM14
B12
E11
AJ11
AM10
B8
E7
AJ7
AM6
B4
D4
G5
L5
Q5
U5
Y5
AC5
AG5
AL3
AK4
D2
H2
D18
M2
V2
Z2
AD2
AH2
AM2
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
AM34
5,7
5
VCCVID
370PGA Socket Part 1
DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
1.3
370-PIN SOCKET, PART 1
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
PROJECT: INTEL(R) 810 CHIPSET SHEET:
11-23-1998_13:44 3 1
OF
40
8
7
6
5
370PGA Socket Part 2
4
3
2
1
VTT1_5 4,33 VCMOS
4
R9
VCCVID
GTLREF
6
8
VCMOS
7
4,33
ITP Test Port Option
VCC2_5
5
VTT1_5
VCMOS
4,33
VCC2_5
220
RP2
D
R7
6 VCCVID
32 4,5,7 R76
VCMOS Decoupling
J35
APICD1
L35
APICCLK_U
J33
UHCLK
W37
PWRGOOD
AK26 X4
URST#
AG1
EDGCTRL
51
C6
R5
0.1UF
A
Do Not Stuff C114 C114 Place Site w/in 0.5" of clock pin (W37).18PF
AA37
K32
F14
AH24
AD32
D32
D36
H36
R36
V36
B22
AH36
B34
F34
K34
P34
T34
X34
AB34
AF34
H32
M32
AK22
AK12
Y35 VCC75
VCC74
VCC73
VCC72
VCC71
VCC70
VCC69
VCC68
VCC67
VCC66
VCC65
VCC64
VCC63
VCC62
VCC61
VCC60
VCC59
VCC58
VCC57
VCC56
VCC55
VCC54
VCC53
VREF7
VREF6
V6
R6
K4
F18
E33
AD6
VREF5
VREF4
VREF3
VREF2
VREF1
Z36
RSRVD41 RSRVD42
PICD0
RSRVD43
PICD1
RSRVD44
PICCLK
RSRVD45 BCLK
RSRVD46 RSRVD47
PWRGOOD
RSRVD48
RESET#
RSRVD49
EDGCTRL
RSRVD50 RSRVD51
UPRES# GND51
4,33
C37
Place 0603 Package Near VCMOS Processor Pin.
RSRVD39
AF32
VCMOS
RSRVD40
GND80
6
APICD0
BPRI# HTRDY#
AN19
DEFER#
AK20
HLOCK#
AN27
DRDY#
AL23
HITM#
AL25
HIT#
AL27
DBSY#
AN31
HADS#
RSRVD52
5,7 5,7 5,7 5,7 5,7 5,7 5,7 5,7 5,7 5,7
AE37 AJ33
FREQSEL
AN29
BR0#
6,9
C
5
AL31 AL29 AH28 AE33
A20M#
AG35
STPCLK#
AH30
USLP#
AJ35
SMI#
M36
INTR
L37
NMI
AG33
INIT#
AC35
FERR#
AG37
IGNNE#
13,33 13,33 13,33 13,33 13,33 13,33 13,15,33 13,33 13,33
AE35
VCCVID W33
PLL1
U33
PLL2
L22
S37
C123
+ 1
4.7UH
33UF 20%
U35
B
VCC3_3
U37 V4 W3
R171 220
W35 X6 Y1 E21
VCOREDET
E27
SLEWCTRL
R2 S35
RTTCTRL
X2
33
680
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
370-PIN SOCKET, PART 2 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
9
33
Y33
13,33
RSRVD38
GND79
13,33
BNR#
AN17 AN25
2
RSRVD37
GND78
0.1UF
PLL2
AH14
RSRVD36
AJ31
0.1UF
PLL1
RSRVD35
Y37
0.1UF
S33
C207
IERR#
RSRVD34
GND77
0.1UF
C204
RSRVD33
AN3
1%
C209
IGNNE#
GND76
C206
FERR#
RSRVD32
AL1
R104 150
RSRVD31
GND75
Q37
INIT#
AJ3
Q35
4
RSRVD30
GND74
Q33 GTLREF
B
LINT1/NMI
AC33
N37
LINT0/INTR
RSRVD29
GND73
N35
RSRVD28
A37
Use 0603 Packages and distribute within 500 mils of Mendocino GTLREF Inputs (1 cap for every 2 inputs).
1%
SMI#
GND72
N33
R102 75
RSRVD27
F36
L33
SLP#
GND71
G37
RSRVD26
GND70
GTLREF Generation Circuit
STPCLK#
K36
G35
RSRVD25
A20M#
P36
F10
Part 2
RSRVD24
GND69
VTT1_5
THRMDN THERMTRIP#
RSRVD23
T36
E31
THRMDP
RSRVD22
GND68
E29
RSRVD21
GND67
E23
BR0#
370-Pin Socket
RSRVD20
X36
C33
BSEL#
RSRVD19
AF36
C31
BPM1#
GND66
B36 C29
FLUSH#
AK36
AN23
BPM0#
GND65
AN21
ADS#
D34
E35 AN15
DBSY#
BP3#
GND64
C35
BP2#
H34
30
E37
GND63
29
G33
4,5
M34
28
ITPRDY#
240
HIT#
GND62
27
R21
PRDY#
GND61
26
HITM#
R34
24
25
DRDY# PREQ#
GND60
23
ITPRDY#
4,5
LOCK#
V34
22
TMS
GND59
21
J37 A35
DEFER#
GND58
20
TMS AK32
TRDY#
TCK
Z34
19
R_ITPRDY#
R4 47
TRST#
AH34
18
R_TMS
4
AL33
AD34
17
ITPREQ#
TCK
GND57
16
R3 47
B32
15
R_TCK
4
GND56
14
BPRI#
GND55
13
TDO
F32
AN33
GND54
AN37
TRST#
P32
TDO
12
BNR#
T32
10
11
JP1 is a Test Option Only.
TDI
GND53
AN35
X32
TDI
V2_5
8
VREF0
6
7
ITPCLK
6
4
5
0K
ITP_PON9
C
3
4
R_TMS
4
X2
R_DBRST# 3
GND52
R_TCK
4
R2
2
AB32
DBRESET# 240
32
ITP_RST 1
V1_5
330
J2 1
4,5,7
R1
AD36
1K URST#
AB36
JP1
150
V_CMOS
R8
2
D
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
4
OF
40
8
7
6
5
4
3
2
1
GTL Termination VTT1_5
VTT1_5
VTT1_5
VTT1_5
D
D
RP6
RP19 1
8
HA#17
2
7
HA#22
3
6
HA#31
4
5
HA#19
HA#[31:3]
3,7
BPRI#
4,7
1
8
HD#15
1
8
HD#54
7
HREQ#4
3,7
2
7
HD#1
2
7
HD#55
3
6
HLOCK#
4,7
3
6
HD#0
3
6
HD#52
4
5
RS#1
3,7
4
5
HD#6
4
5
HD#40
56 8
HA#18
2
7
HA#21
3
6
4
5
HA#25 HA#10
8
HTRDY#
2
7
RS#0
3
6
DRDY#
4
5
DBSY#
8
HD#8
1
8
HD#56
2
7
HD#5
2
7
HD#61
4,7
3
6
HD#9
3
6
HD#62
4,7
4
5
HD#4
4
5
HD#46
3,7
56
8
HA#15
2
7
HA#12
3
6
HA#3
4
5
HA#6
1
8
HITM#
2
7
HIT#
3
6
RS#2
5
HADS#
4
56
1
8
HD#16
1
8
HD#60
4,7
2
7
HD#23
2
7
HD#50
3
6
HD#21
3
6
HD#53
5
HD#24
4
5
HD#58
3,7
4
4,7
8
HA#30
2
7
HA#24
3
6
HA#20
4
5
HA#23
8
HREQ#0
2
7
DEFER#
3
6
HREQ#3
4
5
HREQ#2
1
8
HD#3
1
8
HD#57
4,7
2
7
HD#12
2
7
HD#63
3,7
3
6
HD#10
3
6
HD#59
3,7
4
5
HD#17
4
5
HD#48
3,7
56 8
HA#28
2
7
HA#13
3
6
HA#16
4
5
HA#5
ITPRDY#
1
8
1
8
HD#30
1
8
HD#47
2
7
2
7
HD#7
2
7
HD#27
3
6
3
6
HD#11
3
6
HD#44
4
5
4
5
HD#20
4
5
HD#45
BR0#
4
4
56
56
56 56 B
RP39
RP26
RP3
RP12
56
56
56
1
RP36
RP24
1
RP37
RP25
RP7 1
8
HA#9
2
7
HA#11
3
6
HA#7
4
5
HREQ#1
1
8
HD#13
1
8
HD#49
2
7
HD#18
2
7
HD#51
3
6
HD#14
3
6
HD#41
4
5
HD#2
4
5
HD#42
3,7
56
RP43 8
HA#8
2
7
HA#4
3
6
4
5
BNR#
4,7
B
56
56
RP11 1
C
56
56
RP10
RP20
RP32
4,7
56
1
56
RP35
RP5
RP8 1
RP33
1
4,7
56
56 C
RP23
1
3,7
56
56
RP9
RP18
HD#[63:0]
8
2
56
1
RP38
RP22
1
RP40
1
8
HD#31
1
8
HD#36
2
7
HD#32
2
7
HD#22
3
6
HD#25
3
6
HD#43
4
5
HD#26
4
5
HD#34
HA#14
56 56
56
RP41
RP21 URST#
1
8
2
7
HA#26
3
6
HA#29
4
5
HA#27
4,7
A
RP42
1
8
HD#29
1
8
HD#39
2
7
HD#19
2
7
HD#37
3
6
HD#35
3
6
HD#38
4
5
HD#33
4
5
HD#28
56
56
56
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
GTL TERMINATION DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
5
OF
38
8
7
6
5
4
3
2
1
VCC3_3
Clock Synthesizer
L17 USBV3
2
1
1
22UF
VCC3_3
0.1UF
2
VCC3_3
C50
+
C55
L13 1
D
L16 2
1
D
2
C38
C40
C39
C388
C385
.001UF
.001UF
C386
C63
C60
C387
C64
C61
C48
2
C37
+
C158
2
+
1
MEMV3
1
PCIV3
22UF
0.1UF
.001UF
0.1UF
.001UF
0.1UF
.001UF
0.1UF
0.1UF
.001UF
0.1UF
22UF
Notes: - Place all decoupling caps as close to VCC/GND pins as possible R41
- PCI_0/ICH pin has to go to the ICH. (This clock cannot be turned off through SMBus)
16 14
SIO_CLK14
C49
R184 10
ICH_CLK14
4
8 13 16 17 17 18 27 15
R42 22
ICH_3V66 GMCH_3V66 R49 22
PCLK_2 PCLK_3 PCLK_4 PCLK_5 PCLK_6
R50 33 R52 33 R51 33
3V66_0
7
3V66_1
8
PCI_0
11
PCI_1
12
R44 33
PCI_2
13
PCI_3
15
R45 33
PCI_4
16
PCI_5
18
R46 33
PCI_6
19
R53 33
USB_0
25
USB_1
26
R43 33
PCLK_0/ICH PCLK_1
APIC
20
APIC_0 APIC_1
REF XTAL_OUT
U_0 U_1 U_2/ITP
REF0
3V66_0
SDRAM_0
3V66
3V66_1
SDRAM_1
ICS9250-10 PCI_0/ICH
CK-Whitney
PCI_1
SDRAM_2 SDRAM_3
Memory
SDRAM_4 SDRAM_5
PCI_2 PCI_3
SDRAM_6
PCI
SDRAM_7
PCI_4
PCI_6
DCLK
DOTCLK
R47 22
USB_0
SCLK
USB
USB_1
SDATA SEL1
1
B
USBCLK
APIC_0
54
APIC_1
R34 33
52
U_0_1
R32
APICCLK_U R25 33 33
50 49
U_2
46
DRAM_0
45
DRAM_1
43
DRAM_2
42
DRAM_3
40
DRAM_4
39
DRAM_5
37
DRAM_6
36
DRAM_7
34
DCLK
SEL0
13
R35 33
R26 33
R27 22 R28 22 R29 22 R30 22
GMCHHCLK
7
ITPCLK
R36 22
MEMCLK0
R37 22
MEMCLK2
R38 22
MEMCLK4
R39 22
MEMCLK6
R40 22
DCLK_WR
C
4 4
MEMCLK[7:0]
11,12
MEMCLK1 MEMCLK3 MEMCLK5 MEMCLK7
CK_PWRDN#
32 31
CK_SMBCLK
30
CK_SMBDATA
VCC2_5
8 32 25
L15
25
B
29 28
FREQSEL
4,9 1
L_CKVDDA
4
APICCLK_ICH UHCLK
PCI_7 PWRDWN#
9
55
PCI_5
L18
14
SEL1_PU
38
33
27
21
10
44 VDD3_3[7]
VDD3_3[6]
VDD3_3[5]
VDD3_3[4]
VDD3_3[3]
XTAL_IN
U 1
REFCLK
14
2
XTAL_OUT
12PF
R48 10
VCC3_3
3
14.318MHZ
2
1
C
VDD3_3[2]
VDD3_3[0] XTAL_IN
XTAL
Y1
2
12PF
VDD3_3[1]
2
C51
9
8.2K
U1
- U_ITP pin has to go to the ITP. It is the only U CLK that can be shut off through the SMBUS interface.
L_VCC2_5
VDD_A VDD2_5[0]
53
VSS3_3[7]
VSS3_3[6]
VSS3_3[5]
VSS3_3[4]
VSS3_3[3]
VSS3_3[2]
VSS_A VSS3_3[1]
23
1
VDD2_5[1]
.001UF
VSS3_3[0]
0.1UF
51
VSS2_5[1] VSS2_5[0]
56
C46
C47
+
22
C53
C56
48 2
C52
.001UF
0.1UF
4.7UF
47
41
35
24
6
17
CLK14 trace to JP6.
14
5
Minimize Stub Length from
APIC Clk Strap 16MHz 33MHz
A
JP6 in out*
JP1
JP6
A R23 10K REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
CLOCK SYNTHESIZER DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
12-8-1998_13:05 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
6
OF
40
5
4
W13
R81 150
C166
F8
F10
F14
GTLREFB
6 0.1UF
.001UF
HD0# HD1# HD2# HD3# HD4# HD5#
C167
1%
13,17,18,24,27 4,5 4,5 4,5 4,5 4,5 4,5 4,5 4,5 4,5 4,5 4,5
GMCHHCLK
V6
PCIRST#
M2
URST#
AB4
HLOCK#
P5
DEFER#
R3
HADS#
N3
BNR#
T3
M4 N1
HITM#
R1
HTRDY#
N4
HA#4
U1
HA#5
V4
HA#6
V1
HA#8
U2
HA#9
U3
HA#10
W1
HA#11
U4
HA#12
W3
B
HD12# HD13#
INTEL 82810-DC100
DBSY#
HD14# HD15# HD16#
PART1
HIT#
HD17# HD18# HD19#
HOST INTERFACE
HA3#
HD20# HD21#
HA4#
HD22#
HA5#
HD23#
HA6#
HD24#
HA7#
HD25#
HA8#
HD26#
HA9#
HD27#
HA10#
HD28#
HA11#
HD29#
HA12#
HA#13
W4
HA#14
T5
HA#15
W2
HA#16
V2
HA#17
AC2
HD30#
HA13#
HD31#
HA14#
HD32#
HA15#
HA#18
AA2
HA#19
Y3
HA#20
HD11#
HTRDY#
U5
T4
HD10#
HITM#
HA#3
HA#7
HD9#
HLOCK#
DRDY#
P1
C
URST#
BPRI#
HIT#
3,5
HD8#
BNR#
DBSY#
HA#[31:3]
HD7#
RESETB
ADS#
T1
DRDY#
HD6#
HTCLK
DEFER#
BPRI#
AB3
HA#21
AA1
HA#22
AB2
HA#23
AC3
HA#24
AA3
HA#25
Y2
HA#26
AB5
HA#27
AC4
HA#28
Y1
HA#29
AC5
HA#30
Y4
HA#31
AB1
HD33#
HA16#
HD34#
HA17#
HD35#
HA18#
HD36#
HA19#
HD37#
HA20#
HD38#
HA21#
HD39#
HA22#
HD40#
HA23#
HD41#
HA24#
HD42#
HA25#
HD43#
HA26#
HD44#
HA27#
HD45#
HA28#
HD46#
HA29#
HD47#
HA30#
HD48#
HA31#
HD49#
HREQ#[4:0] 3
RS#[2:0] 3
HREQ#0
R4
HREQ#1
T2
HD50# HREQ0#
P4
HREQ#3
R2
HREQ#4
R5
RS#0
HD51#
HREQ1#
HREQ#2
HD52#
HREQ2#
HD53#
HREQ3#
HD54#
HREQ4#
N5
HD55# HD56#
RS0#
RS#1
P2
RS#2
N2
HD57#
RS1#
HD58#
RS2#
HD59#
A VSS[23]
VSS[22]
VSS[21]
HD61# HD62# HD63#
N13
N14
M10
VSS[19]
VSS[18]
VSS[20] M11
M12
M13
VSS[16]
VSS[15]
VSS[17] M14
L10
L11
VSS[13]
VSS[14] L12
L13
VSS[11]
VSS[10]
VSS[9]
VSS[8]
VSS[7]
VSS[12] L14
K10
K11
K12
K13
K14
VSS[5]
VSS[4]
VSS[3]
VSS[2]
VSS[1]
VSS[6] E22
C19
Y19
J22
N22
Y22
V18
VSS[0]
HD60#
Do Not Stuff C161 C161 Place Site w/in 0.5" of clock ball (V6). 18PF
2
1
F7 VCC_CORE[13]
VCC_CORE[12]
VCC_CORE[11]
F17
V7
V8
V9
V10
V14
V15
F16 VCC_CORE[9]
VCC_CORE[10]
VCC_CORE[8]
VCC_CORE[7]
VCC_CORE[6]
VCC_CORE[5]
VCC_CORE[4]
VCC_CORE[3]
V16
V17
GTLREFA
VCC_CORE[2]
M5
GMCHGTLREF
D
VCC_CORE[1]
VCC1_8[0]
1%
VCC_CORE[0]
U2 R80 75
P6
B20
82810-DC100, PART 1: HOST INTERFACE
3
VCC1_8
U18
6
VCC1_8[2]
7 VTT1_5
VCC1_8[1]
8
HD#[63:0]
Y5
HD#0
W5
HD#1
W8
HD#2
AA6
HD#3
AB6
HD#4
Y6
HD#5
AA5
HD#6
AA9
HD#7
V5
HD#8
AC7
HD#9
AB7
HD#10
AC8
HD#11
AA7
HD#12
Y8
HD#13
W7
HD#14
AC6
HD#15
W9
HD#16
AC9
HD#17
Y7
HD#18
AA10
HD#19
AB8
HD#20
AC10
HD#21
AB13
HD#22
AB10
HD#23
AB9
HD#24
AB11
HD#25
Y10
HD#26
AB16
HD#27
AB12
HD#28
Y11
HD#29
Y9
HD#30
AC12
HD#31
W11
HD#32
AC11
HD#33
W12
HD#34
AA11
HD#35
AA13
HD#36
Y13
HD#37
Y12
HD#38
AC14
HD#39
AA15
HD#40
AC15
HD#41
Y14
HD#42
AC13
HD#43
AA14
HD#44
AB14
HD#45
Y17
HD#46
Y15
HD#47
AC17
HD#48
AC16
HD#49
AA18
HD#50
AB15
HD#51
W15
HD#52
AB18
HD#53
W17
HD#54
AA17
HD#55
W18
HD#56
W16
HD#57
AC19
HD#58
Y16
HD#59
AB19
HD#60
Y18
HD#61
AC18
HD#62
AB17
3,5
D
C
B
A
HD#63 REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
82810-DC100 : HOST INTERFACE DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
7
OF
40
8
7
6
5 VCC1_8
82810-DC100 PART 2: SYSTEM MEMORY AND HUB INTERFACE
4
VCC3SBY
3
2
1
VCC3_3
A9
SM_MAA3
D7
SM_MAA4
8
1
R_MAA4
B8
SM_MAA5
7
2
R_MAA5
A8
SM_MAA6
6
3
R_MAA6
B7
SM_MAA7
5
4
R_MAA7
A7
SM_MAA8 RP70 and RP71 should be placed within 0.5" of the GMCH balls.
SM_MAB[7:4]# Place HUBREF Generation Circuit in middle of VCC1_8 GMCH and ICH.
12
RP70
C6
SM_MAA10
D5
SM_MAA11
A5
SM_MAB4#
8
1
R_MAB#4
B6
SM_MAB5#
7
2
R_MAB#5
A6
SM_MAB6#
6
3
R_MAB#6
B4
SM_MAB7#
5 RP71
SM_DQM[7:0]
HUBREF
8,13
SM_BS[1:0]
R131 301 1%
R176 56
C10 A10
SM_DQM2
B1
SM_DQM3
D1
SM_DQM4
B10
SM_DQM5
D9
SM_DQM6
C1
SM_DQM7
D2
C5
SM_BS1
E5
J18
F18
R18 VCC3_3[15]
VCC3_3[14]
VCC3_3[13]
L21
G21 VCC3_3[12]
VCC3_3[11]
B2
K6
F9
F15
G3
L3
C15
C7
C11
F6 VCC3_3[9]
VCC3_3[10]
VCC3_3[8]
VCC3_3[7]
SMD1 SMD2 SMD3 SMD4
SMAA3
SMD5
SMAA4
SMD6
SMAA5
SMD7
SMAA6
SMD8
SMAA7
SMD9
SMAA8
SMD10
SMAA9 SMAA10
SMD11
INTEL 82810-DC100
SMAA11
SMD12 SMD13 SMD14
SMAB4#
PART 2
SMAB5#
SMD15 SMD16
SMAB6#
SMD17
SMAB7#
SYSTEM MEMORY
SMD18 SMD19
SDQM0 SDQM1
SMD20
AND
SDQM2
SMD21 SMD22
SDQM3
HUB INTERFACE
SDQM4
SMD23 SMD24
SDQM5
SMD25
SDQM6
SMD26
SDQM7
SMD27 SMD28
SBS0
SMD29
SBS1
SMD30
SM_CS#[3:0]
SM_CS#0
11,12 470PF
11,12 11,12 11,12
C3
SM_CS#2
B3
SM_CS#3
C2
SM_CAS#
A11
SM_WE#
B11
0K
DCLK_WR
SM_CS#1
D8
11,12
B
C4
SM_RAS#
SM_CKE[1:0]
SM_CKE0
A3
SM_CKE1
A2
SCLK
E6
SMD31
SCS0#
SMD32
SCS1#
SMD33
SCS2#
SMD34
SCS3#
SMD35 SMD36
SRAS#
SMD37
SCAS#
SMD38
SWE#
SMD39 SMD40
SCKE0
SMD41
SCKE1
SMD42
SCLK
SMD43
R31
HUBREF HLSTB#
A20 GHCOMP D18
SMD59
HCOMP
SMD60
0.1UF
SMD61 SMD62 SMD63
E17
SM_MD0
C16
SM_MD1
D15
SM_MD2
D17
SM_MD3
C17
SM_MD4
A17
SM_MD5
A16
SM_MD6
B16
SM_MD7
A15
SM_MD8
C14
SM_MD9
B14
SM_MD10
A14
SM_MD11
D13
SM_MD12
C13
SM_MD13
A13
SM_MD14
A12
SM_MD15
E1
SM_MD16
F2
SM_MD17
G4
SM_MD18
G1
SM_MD19
D3
SM_MD20
H2
SM_MD21
H1
SM_MD22
J4
SM_MD23
J1
SM_MD24
K2
SM_MD25
K1
SM_MD26
K3
SM_MD27
L1
SM_MD28
L2
SM_MD29
M3
SM_MD30
K4
SM_MD31
D16
SM_MD32
E15
SM_MD33
D14
SM_MD34
E14
SM_MD35
E13
SM_MD36
E12
SM_MD37
D12
SM_MD38
B15
SM_MD39
B12
SM_MD40
C12
SM_MD41
D11
SM_MD42
D10
SM_MD43
E10
SM_MD44
E9
SM_MD45
E8
SM_MD46
C8
SM_MD47
F3
SM_MD48
F1
SM_MD49
G2
SM_MD50
H3
SM_MD51
E4
SM_MD52
E3
SM_MD53
F4
SM_MD54
J3
SM_MD55
F5
SM_MD56
G5
SM_MD57
H5
SM_MD58
H4
SM_MD59
H6
SM_MD60
J5
SM_MD61
K5
SM_MD62
L5
SM_MD63
SM_MD[63:0] 11,12
D
C
B
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
J2
L4
P3
M1
R6
V3
W14
W10
W6
AA16
AA8
AA12
AA4
18PF
P10
C236 AC1
Place C241 as close as possible to GMCH
SMD58
HLSTB#
VSS[24]
C241
HLSTB
P11
8,13
A21
SMD57
P12
A
HLSTB
SMD56
HUBREF
P13
8,13
D20
SMD55
HL10
VSS[45]
A19
VSS[44]
HL10
HL9
VSS[43]
C20
SMD54
VSS[42]
HL9
SMD53
HL8
VSS[41]
A22
VSS[40]
HL8
SMD52
HL7
VSS[39]
A18
VSS[38]
HL7
SMD51
HUB I/F
HL6
VSS[37]
C18
VSS[36]
HL6
SMD50
HL5
VSS[35]
B18
VSS[34]
HL5
SMD49
HL4
VSS[33]
B19
VSS[32]
HL4
SMD48
HL3
VSS[31]
A23
VSS[30]
HL3
SMD47
HL2
VSS[29]
B22
HL1
VSS[28]
HL2
SMD46
VSS[27]
B23
SMD45
HL0
VSS[26]
HL1
SMD44 HLCLK
P14
22PF
C21
VSS[25]
D19
HL0
N10
GMCH_3V66 HL[10:0]
6,8 13
N11
C168
N12
6
A4
SMD0
SMAA2
10 OHMS
SM_BS0
11,12
C299 HUBREF_CG
R_MAB#7
SM_DQM1 R130 301 1%
R177 56
4
SM_DQM0
11,12 470PF
C
D6
SM_MAA9
C300 HUBREF_CV
10 OHMS
SMAA1
VCC3_3[6]
E7
SM_MAA2
VCC3_3[5]
SM_MAA1
D
SMAA0
VCC3_3[4]
C9
VCC3_3[3]
SM_MAA0
VCC3_3[2]
11,12
U2
VCC3_3[0]
SM_MAA[11:0]
VCC3_3[1]
R82 40 1%
as possible to GMCH
D4
Place Resistor as Close
1.3
82810-DC100: SYSTEM MEMORY AND HUB DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:13 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
8
OF
40
7
6
5
4
3
82810-DC100, PART 3: DISPLAY CACHE AND VIDEO INTERFACE
L24
10
GMCH RESET STRAPS 10 10
VCOREDET
4
10 FREQSEL
4,6
10
DC_DQM1
R23
DC_DQM2
C23
DC_DQM3
F20
DC_RAS#
K19
DC_CAS#
K20
DC_WE#
J19
DC_MA[11:0]
VCC3_3
DC_MA0
M19
DC_MA1
P19
DC_MA2
P20
6
7
RP48
4
3
2 GRS_PU30
1
10K
GRS_PU31
4 GRS_PU26
3
2
1
10K
GRS_PU28
C
5
8
6
5
7
8
DC_MA3
RP46
10
JP16 JP15
DC_MD31 DC_MD30 DC_MD29
JP14
DC_MD28 DC_MD27
JP13
Function XOR
DC_MD26
System Bus Frequency IOQD VCORE Detect RESVD
9,10 9,10 9,10 9,10 9,10 9,10
JP15 N/A
READS System Bus Frequency
JP16
B
Tri-State
DC_MD[31:0]
Function IN=XOR TREE OUT=NORMAL* IN=TriState Mode OUT=NORMAL*
Jumper
IN=IO Queue Depth 1 OUT=IO Queue Depth 4* Detects Type of Processor N/A I/O Buffers JP13 TBD
JP14
10
P21
J21
DC_MA5
H19
DC_MA6
H20
DC_MA7
H18
DC_MA8
G19
DC_MA9
F19
DC_MA10
M20
DC_MA11
L19
DC_MD0
M22
DC_MD1
M21
DC_MD2
L23
DC_MD3
L22
DC_MD4
K21
DC_MD5
K23
DC_MD6
R19
DC_MD7
R20
DC_MD8
R22
DC_MD9
R21
DC_MD10
P23
DC_MD11
P22
DC_MD12
N23
DC_MD13
N21
DC_MD14
N20
DC_MD15
M23
DC_MD16
F23
DC_MD17
E20
DC_MD18
E21
DC_MD19
E23
DC_MD20
D22
DC_MD21
D23
DC_MD22
D21
DC_MD23
C22
DC_MD24
H21
DC_MD25
H22
DC_MD26
H23
DC_MD27
G20
DC_MD28
G22
DC_MD29
G23
DC_MD30
F21
DC_MD31
F22
R127
DC_CLK
N19
DC_MA4
R_LTCLK
K22
RCLK
J20
OCLK
J23
AB21
AB23
VCCDA
VCCDACA2
E19 VCCBA
U6 VCCHA
LCS#
VCCDACA1
DC_DQM0
LTVDATA0
LDQM0
LTVDATA1
LDQM1
LTVDATA2
LDQM2
LTVDATA3
LDQM3
LTVDATA4
VIDEO DIGITAL OUT
LRAS#
LTVDATA5 LTVDATA6
LCAS#
INTERFACE
LWE#
LTVDATA7 LTVDATA8
LMA0
LTVDATA9
LMA1
LTVDATA10
LMA2
LTVDATA11
LMA3
BLANK#
LMA4
TVCLKIN/SL_STALL
INTEL 82810-DC100
LMA5
CLKOUT0
LMA6
CLKOUT1
LMA7
PART3
LMA8
TVVSYNC TVHSYNC
OCLK_FB
0K
R129
LMA10
LTVCL
DISPLAY CACHE
LMA11 LMD0
LTVDA
FTD0
Y20
FTD1
W23
FTD2
W22
FTD3
W21
FTD4
V23
FTD5
U23
FTD6
U22
FTD7
U21
FTD8
T23
FTD9
T22
FTD10
T21
FTD11
D
FTD[11:0]
FTBLNK#
V19 U20
SL_STALL
V21
FTCLK0
V22
FTCLK1
V20
FTVSYNC
U19
FTHSYNC
T19
3VFTSCL
T20
3VFTSDA
24
24 24 24 24 24 24
C
24,25 24,25
AND
LMD1 LMD2 LMD3
VIDEO INTERFACE
LMD4 LMD5 LMD6 LMD7 LMD8 LMD9 LMD10 LMD11 LMD12 LMD13 LMD14 LMD15 LMD16
B
LMD17 LMD18
DISPLAY CACHE INTERFACE
LMD19 LMD20
DDCDA DDCCL
LMD21
DCLKREF
LMD22
IWASTE
LMD23
IREF
W19
3VDDCDA
W20
3VDDCCL
AA21
DOTCLK
25 25 6
Y23 AA23
IREFPD
LMD24 LMD25 VSYNC
GRAPHICS INTERFACE
LMD26
HSYNC
LMD27
RED
LMD28
GREEN
LMD29
BLUE
LMD30
AA20
CRT_VSYNC
AB20
CRT_HSYNC
AC21
VID_RED
AC22
VID_GREEN
AC23
VID_BLUE
25 25 25 25 25
LMD31
R125 Place as close as 174 Possible to GMCH 1% and via straight to VSS plane.
LTCLK
LRCLK
C379
Do Not Stuff C379 Place Site w/in 0.5" of clock ball (AA21).
18PF
A
LOCLK
VSSDA
VSS[61]
VSS[60]
VSS[59]
VSS[58]
VSS[57]
VSS[56]
VSS[55]
VSS[54]
VSS[53]
VSS[52]
VSS[51]
VSS[50]
VSS[49]
VSS[48]
VSS[47]
VSS[46]
VSSBA
VSSHA
33 Place R129 within 0.5" of the GMCH Ball. C238
Y21
VSSDACA
R128
C222 0.1UF
68NH-0.3A
LMA9
22
A
C216 0.01UF
2
L20
DC_DQM[3:0]
C217
+
DC_CS#
AC20
1
10
1
VCCDACA
U2
D
2 VCC1_8
VCC1_8
33UF 20%
8
REV:
AB22
AA22
AA19
T18
P18
K18
B21
B17
G18
E16
B13
E11
B9
B5
A1
E2
G6
J6
E18
22PF
T6
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
Do Not Populate C238
DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
1.3
82810-DC100: DISPLAY CACHE AND VIDEO
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
9
OF
40
8
7
6
5
4
3
2
1
4MB Display Cache
D
D
DC_MA11
19
DC_CLK
35
DC_CKE
34
A7
DQ7
A8
DQ8
A9 A10 A11
CLK CKE
DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
15
33 37
29
11
DC_MD6
9
DC_MA6
12
DC_MD7
30
DC_MD8
9 9
DC_MA7
39
DC_MA8
31
DC_MD9
DC_MA9
32
40
9
42
DC_MD10
9
DC_MA10
20
43
DC_MD11
9
45
DC_MD12
46
DC_MD13
9
48
DC_MD14
10
49
DC_MD15
UDQM
CAS#
LDQM
19
DC_CLK
35
DC_CKE
34
DC_CS#
18
DC_RAS#
17
DC_CAS#
16
DC_WE#
15
36
DC_DQM1
9
14
DC_DQM0
9 9
33 NC_1
37
NC_2
44
38
A3
DQ3
A4
DQ4
A5
DQ5
A6
DQ6
A7
DQ7
A8
DQ8
A9 A10 A11
CLK CKE
DQ9 DQ10 DQ11 DQ12 DQ13 DQ14
3
DC_MD17
5
DC_MD18
6
DC_MD19
8
DC_MD20
9
DC_MD21
11
DC_MD22
12
DC_MD23
39
DC_MD24
40
DC_MD25
42
DC_MD26
43
DC_MD27
45
DC_MD28
46
DC_MD29
48
DC_MD30
49
DC_MD31
36
DC_DQM3
14
DC_DQM2
DC_DQM[3:0] 9
C
CS# RAS#
UDQM
CAS#
LDQM
WE#
NC_1 NC_2
50
26
47
41
10
4
13
7
DQ2
4
B
DQ1
A2
DQ15
9
WE#
DC_MA11
VDDQ_4
28
VDDQ_3
27
DC_MA5
VDDQ_2
DC_MA4
9
VDDQ_1
9
DC_MD5
A1
VSS_1
DC_WE#
9
RAS#
VSS_2
16
VSSQ_1
17
VSSQ_2
DC_RAS# DC_CAS#
9
DC_MD4
9
CS#
VSSQ_3
9 9
18
VSSQ_4
DC_CS#
9
DC_MD3
8
25
1 DQ6
6
24
VDD_1
38
13
44 VDDQ_4
VDDQ_3
7
A6
23
DC_MA3
DC_MD16
VSS_1
20
DQ5
22
DC_MA2
2
B
50
DC_MA10
A5
DC_MA1
9
VSS_2
32
DQ4
9
DC_MD2
9 DQ0
26
DC_MA9
DQ3
A4
DC_MD1
5
VSSQ_1
31
A3
3
47
30
DC_MA8
DQ2
DC_MD[31:0]
SDRAM 50-PIN TSOP
DC_MA7
DQ1
A2
VSSQ_2
29
DQ0
A1
VSSQ_3
DC_MA6
VDDQ_2
28
VDDQ_1
1 27
DC_MA5
VDD_2
24
DC_MA4
VDD_1
DC_MA3
A0
A0
41
9
23
9
21
10
R114 4.7K
22
DC_MA2
2
DC_MD0
DC_MA0
VSSQ_4
C
DC_MA1
SDRAM 50-PIN TSOP
VCC3_3
21
25
U9
U8 DC_MA[11:0] 9 DC_MA0
VCC3_3
VDD_2
VCC3_3
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
DISPLAY CACHE DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
10 OF
40
8 7
A
6
MEMCLK[7:0]
8
8
8
12,14,25,28,33
12,14,25,28,33 8
SM_BS[1:0]
5 SM_DQM7
SM_CS#1
SM_CS#0
SM_MAA[11:0]
SM_CKE1
SM_CKE0
8 SM_DQM6
4 SAO_PU
3 R
164
146
145
135
134
109
108
80
62
61
51
50
NC17
NC16
NC15
NC14
NC13
NC12
NC11
NC10
NC9
NC8
NC7
NC6
NC5
NC4
NC3
NC2
NC1
WP
SA2
SA1
SA0
REGE
SMBCLK
SMBDATA
SM_MD4 SM_MD5 SM_MD6 SM_MD7 SM_MD8 SM_MD9 SM_MD10 SM_MD11 SM_MD12 SM_MD13 SM_MD14 SM_MD15 SM_MD16 SM_MD17 SM_MD18 SM_MD19 SM_MD20 SM_MD21 SM_MD22 SM_MD23 SM_MD24 SM_MD25 SM_MD26 SM_MD27 SM_MD28 SM_MD29 SM_MD30 SM_MD31 SM_MD32 SM_MD33 SM_MD34 SM_MD35 SM_MD36 SM_MD37 SM_MD38 SM_MD39 SM_MD40 SM_MD41 SM_MD42 SM_MD43 SM_MD44 SM_MD45 SM_MD46 SM_MD47 SM_MD48 SM_MD49 SM_MD50 SM_MD51 SM_MD52 SM_MD53 SM_MD54 SM_MD55 SM_MD56 SM_MD57 SM_MD58 SM_MD59 SM_MD60 SM_MD61 SM_MD62 SM_MD63
7 8 9 10 11 13 14 15 16 17 19 20 55 56 57 58 60 65 66 67 69 70 71 72 74 75 76 77 86 87 88 89 91 92 93 94 95 97 98 99 100 101 103 104 139 140 141 142 144 149 150 151 153 154 155 156 158 159 160 161
VCC17 VSS18
VCC16 VSS17
VCC15 VSS16
DIMM0
SLAVE ADDRESS = 1010000B 137
136
106
105
53
52
22
21
SM_MD3
5
3
ECC7
ECC6
ECC5
ECC4
ECC3
ECC2
ECC1
ECC0
DQ63
DQ62
DQ61
DQ60
DQ59
DQ58
DQ57
DQ56
DQ55
DQ54
DQ53
DQ52
DQ51
DQ50
DQ49
DQ48
DQ47
DQ46
DQ45
DQ44
DQ43
DQ42
DQ41
DQ40
DQ39
DQ38
DQ37
DQ36
DQ35
DQ34
DQ33
DQ32
DQ31
DQ30
DQ29
DQ28
DQ27
DQ26
DQ25
DQ24
DQ23
DQ22
DQ21
DQ20
DQ19
DQ18
DQ17
DQ16
DQ15
DQ14
DQ13
DQ12
SM_MD2
4
4
48
44
31
25
24
81
167
166
165
147
83
CKE1
CKE0
RAS#
CAS#
WE#
S3#
S2#
S1#
S0#
DQMB7
DQMB6
DQMB5
DQMB4
DQMB3
DQMB2
DQMB1
DQMB0
BA1
BA0
A13
A12
A11
A10
A9
A8
A7
A6
A5
DQ11
SM_MD1
3
5
82
63
128
115
111
27
129
45
114
30
131
130
113
112
47
46
29
28
39
122
132
126
123
38
121
37
120
36
A4
SM_MD0
2
6
SM_DQM5
SM_DQM4
SM_DQM3
SM_DQM2
SM_DQM1
SM_DQM0
6 SM_BS1
SM_BS0
SM_MAA11
SM_MAA10
35 119
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
7
SM_MAA9
SM_MAA8
SM_MAA7
SM_MAA6
SM_MAA5
SM_MAA4
A3
6
A2
18
118
26
SM_MAA3
40
A1
41
34
90
117
102
SM_MAA2
49
SM_MAA1
110
A0
124 VCC12
33
59 VCC13
SM_MAA0
73
CLK3
84
163
C VCC14
MEMCLK3
133
CLK2
143
CLK1
157
79
168
125
CLK0
VCC3SBY
MEMCLK2
42
D
MEMCLK1
MEMCLK0
8 2
VSS15
VSS14
VSS13
VCC11 VSS12
VCC10 VSS11
VCC9 VSS10
VCC8 VSS9
VCC7 VSS8
VCC6 VSS7
VCC5 VSS6
VCC4 VSS5
VCC3 VSS4
VCC2 VSS3
VCC1 VSS2
VSS1
PCD PLATFORM DESIGN
1900 PRAIRIE CITY ROAD FOLSOM, CALIFORNIA 95630 2
1
SYSTEM MEMORY
8,12 SM_MD[63:0]
D
162
152
148
138
127
116
107
C
96
85
78
68
64
54
43
32
23
12
1
J11
B B
12
8
8 SM_DQM[7:0]
8 SM_CS#[3:0]
SM_WE#
SM_CAS#
SM_RAS#
SM_CKE[1:0]
A
SMBDATA
SMBCLK TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
SYSTEM MEMORY: DIMM0
REV:
DRAWN BY:
INTEL CORPORATION
PLATFORM COMPONENTS DIVISION LAST REVISED:
12-8-1998_13:14 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
1.3
11 OF
40
8 7
A
6 8
8
8
8
11,14,25,28,33
11,14,25,28,33
5
SM_MAA[11:0] SM_DQM7
SM_DQM6
SM_CS#3
SM_CS#2
8 SM_DQM5
SM_DQM4
SM_DQM3
SM_DQM2
SM_DQM1
SM_DQM0
35
121 38 123
SM_MAA9 SM_MAA10 SM_MAA11
SM_BS1
SM_MAB[7:4]#
8 SM_BS[1:0]
4 3 R
PCD PLATFORM DESIGN
1900 PRAIRIE CITY ROAD FOLSOM, CALIFORNIA 95630 2
164
146
145
135
NC17
NC16
NC15
NC14
NC13
NC12
NC11
NC10
NC9
NC8
NC7
NC6
NC5
NC4
NC3
NC2
NC1
VCC17
DIMM1
VCC14 VSS15
VCC13 VSS14
SLAVE ADDRESS = 1010001B
ECC7
ECC6
ECC5
ECC4
ECC3
ECC2
ECC1
ECC0
DQ63
DQ62
DQ61
DQ60
DQ59
DQ58
DQ57
DQ56
DQ55
DQ54
DQ53
DQ52
DQ51
DQ50
DQ49
DQ48
DQ47
DQ46
DQ45
DQ44
DQ43
DQ42
DQ41
DQ40
DQ39
SM_MD3 SM_MD4 SM_MD5 SM_MD6 SM_MD7 SM_MD8 SM_MD9 SM_MD10 SM_MD11 SM_MD12 SM_MD13 SM_MD14 SM_MD15 SM_MD16 SM_MD17 SM_MD18 SM_MD19 SM_MD20 SM_MD21 SM_MD22 SM_MD23 SM_MD24 SM_MD25 SM_MD26 SM_MD27 SM_MD28 SM_MD29 SM_MD30 SM_MD31 SM_MD32 SM_MD33 SM_MD34 SM_MD35 SM_MD36 SM_MD37 SM_MD38 SM_MD39 SM_MD40 SM_MD41 SM_MD42 SM_MD43 SM_MD44 SM_MD45 SM_MD46 SM_MD47 SM_MD48 SM_MD49 SM_MD50 SM_MD51 SM_MD52 SM_MD53 SM_MD54 SM_MD55 SM_MD56 SM_MD57 SM_MD58 SM_MD59 SM_MD60 SM_MD61 SM_MD62 SM_MD63
5 7 8 9 10 11 13 14 15 16 17 19 20 55 56 57 58 60 65 66 67 69 70 71 72 74 75 76 77 86 87 88 89 91 92 93 94 95 97 98 99 100 101 103 104 139 140 141 142 144 149 150 151 153 154 155 156 158 159 160 161
137
136
106
105
53
52
22
21
SM_MD2 4
3
134
109
108
80
62
61
51
50
48
44
31
25
24
WP
SA2
SA1
SA0
REGE
SMBCLK
SMBDATA
CKE1
CKE0
RAS#
CAS#
DQ38
DQ37
DQ36
DQ35
DQ34
DQ33
DQ32
DQ31
DQ30
DQ29
DQ28
DQ27
DQ26
DQ25
DQ24
DQ23
DQ22
DQ21
DQ20
DQ19
DQ18
DQ17
DQ16
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
SM_MD1 3
4
81
167
166
165
147
83
82
63
128
115
WE#
S3#
S2#
S1#
S0#
DQMB7
DQMB6
DQMB5
DQMB4
DQMB3
DQMB2
DQMB1
DQMB0
BA1
BA0
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
SM_MD0 2
5
111
27
129
45
114
30
131
130
113
112
47
46
29
28
39
122
132
126
37
120
36
119
SM_MAA8
SM_BS0
SM_MAB7#
SM_MAB6#
SM_MAB5#
34
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
6
SM_CKE1
MEMCLK[7:0]
SM_CKE0
6 DQ1
DQ0
7
SM_MAB4#
B 118
6
SM_MAA3
18
SM_MAA2
26 VCC12
A1
40 VCC15
A0
41
117
90
SM_MAA1
102
33
110
SM_MAA0
49 VCC16
CLK3
124
CLK2
C
163
59
MEMCLK7
73
CLK1
84
79
133
125
143
MEMCLK6
157
MEMCLK5
CLK0
168
42
VCC3SBY
MEMCLK4
8 2 1
SYSTEM MEMORY
8,11 SM_MD[63:0]
D D
VSS18
VSS17
VSS16
VSS13
VCC11 VSS12
VCC10 VSS11
VCC9 VSS10
VCC8 VSS9
VCC7 VSS8
VCC6 VSS7
VCC5 VSS6
VCC4 VSS5
VCC3 VSS4
VCC2 VSS3
VCC1 VSS2
VSS1
162
152
148
138
127
116
107
96
85
78
C
68
64
54
43
32
23
12
1
J13
VCC3SBY
SAO_PU
R60
B
2.2K
8
8 SM_DQM[7:0]
8 SM_CS#[3:0]
SM_WE#
SM_CAS#
SM_CKE[1:0] SM_RAS#
SMBDATA
SMBCLK
A
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
SYSTEM MEMORY: DIMM1
REV:
DRAWN BY:
INTEL CORPORATION
PLATFORM COMPONENTS DIVISION LAST REVISED:
12-8-1998_13:14 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
1.3
12 OF
40
6
5
3
C1
AD13
B1
AD14
D4
AD15
C3
AD16
C
C_BE#[3:0]
17,18,27
B
A4
AD17
B4
AD18
C5
AD19
C6
AD20
B5
AD21
E7
AD22
A6
AD23
B6
AD24
D7
AD25
B8
AD26
A7
AD27
A8
AD28
B7
AD29
C9
AD30
D8
AD31
C7
C_BE#0
D2
C_BE#1
B2
C_BE#2
A3
C_BE#3
D6
PCLK_0/ICH
6 17,18,27,33 17,18,27,33 17,18,27,33 17,18,27,33 17,18,27,33 7,15,16,17,18,19,24,27 17,18,33
C14
FRAME#
B3
DEVSEL#
D9
IRDY#
A2
TRDY#
C4
STOP#
D5
PCIRST#
J5
PLOCK#
B9
PAR
17,18,27 17,18,27,33 17,18,27 18,33 18 33 33
A9 A1 K1
PCI_REQ#A
N6
PCI_GNT#A
P5
REQ#B/GPIO1
P4
GNT#B/GPIO17
R5
H16
L15
G15
K14
H14
G13
J16 VCC1_8_7
VCC1_8_6
VCC1_8_5
VCC1_8_4
VCC1_8_3
VCC1_8_2
VCC1_8_1
N13
N5
D16
E5
E6
A5
C8
C11
M14
T16
R13
U10
T7
E13 VCC3_3_17
VCC3_3_16
VCC3_3_15
VCC3_3_14
VCC3_3_13
VCC3_3_12
VCC3_3_11
VCC3_3_10
VCC3_3_9
VCC3_3_8
VCC3_3_7
VCC3_3_6
VCC3_3_5
P6
G5
AD7
SMI#
F14
SMI#
AD8
STPCLK#
A17
STPCLK#
RCIN#
A15
RCIN#
A20GATE
B15
A20GATE
AD9 AD10
AD12
INTEL 82801AB PART 1
AD13 AD14 AD15 AD16 AD17
4,33 4,33 4,15,33 4,33 4,33 4,33 4,33 16,33 16,33
D17
HL1
E17
HL1
HL2
F17
HL2
HL3
G16
HL3
HL4
J15
HL4
HL5
K16
HL5 HL6
VCC1_8
HL7
L17
HL7
AD20
HL8
H15
HL8
AD21
HL9
J17
HL9
AD22
HL10
J14
HL10
HUB I/F
C
R182 40, 1%
HL6
AD19
PCI
8
HL0
HL0
K17
AD18
4,33 4,33
HL[10:0]
AD11
Place R182 as close as possible to ICH0. HLSTB
AD23
HLSTB
G17
AD24
HLSTB#
H17
AD25
HCOMP
M17
AD26
HUBREF
J13
PIRQ#A
D10
AD29
PIRQ#B
A10
PIRQ#B
AD30
PIRQ#C
B10
PIRQ#C
PIRQ#D
C10
PIRQ#D
IRQ14
P11
IRQ15
N14
IRQ15
C_BE#2
APICCLK
C16
APICCLK_ICH
C_BE#3
APICD1
C17
APICD1
APICD0
E16
APICD0
SERIRQ
R4
SERIRQ
8
HLSTB#
8
IHCOMP_PU
HUBREF
8
AD27 AD28
AD31
IRQ
C_BE#0 C_BE#1
PCICLK
PIRQ#A
17,18,27,33 17,18,33
0.1UF
17,18,33
Place C302 as close as possible to ICH0.
17,18,33
IRQ14
C302
19,33 19,33 6
B
4,33 4,33 16,18,33
FRAME# DEVSEL#
REQ#0
A14
PREQ#0
IRDY#
REQ#1
B13
PREQ#1
TRDY#
REQ#2
B12
PREQ#2
REQ#3
D12
PREQ#3
GNT#0
A13
PGNT#0
GNT#1
C13
PGNT#1
GNT#2
A12
PGNT#2
GNT#3
C12
PGNT#3
GNT4#
A11
RESV0PU
REQ4#
B11
RESV1PU
HL11
F16
STOP#
PCI
PCIRST# PLOCK# PAR SERR# PME#
REQ#A/GPIO0 GNT#A/GPIO16
PC/PCI
REQ#B/GPIO1/REQ5#
RESV2PD
17,33 17,33 18,33 27,33 17,33 17,33
VCC3_3
18,33 27,33
R174 R175
R181
8.2K
8.2K
0K
GNT#B/GPIO17/GNT5#
Don’t Stuff R181 For Test/Debug
R2
VSS1
SERR# PCI_PME#
NMI
VSS11
AD12
B16
VSS12
C2
NMI
U
AD6
G14
AD11
INTR
K10
E4
E14
VSS9
AD10
INTR
AD5
VSS10
D3
INIT#
J10
D1
AD9
IGNNE#
E15
VSS8
E2
AD8
B17
INIT#
K9
AD7
IGNNE#
AD4
H10
E1
FERR#
AD3
VSS7
AD6
AD2
FERR#
VSS6
F5
A20M# USLP#
F15
J9
AD5
F13 E12
VSS5
F4
A20M# USLP#
K8
F3
AD4
D
AD1
H9
AD3
1
AD0
VSS4
F2
VSS3
G4
AD2
J8
G2
AD1
VSS2
AD0
H8
17,18,27
G3
AD[31:0]
VCC3_3_4
D
2
VCC1_8
VCC3_3_3
E3 VCC3_3_1
U14
VCC3_3_2
ICH0, Part 1
A
4
VCC3_3
A
VSS13
7
K15
8
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
ICH0, PART 1 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_10:37 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
13
OF
40
8
7
6
5
4
3
ICH0
JP20 Config 1-2 Normal 2-3 Clear CMOS
1.0UF
31 22
JP20
JP24_PD
3
2.2UF
11,12,25,28,33 11,12,25,28,33 33
1
R216 R202
1K
1K
VBAT
D14
SLP_S3#
K3
SLP_S3/GPIO24
THRM#
K2
SLP_S5
PWROK
J3
PWROK
PWRBTN#
M2
PWRBTN#
ICH_RI#
L3
RSMRST#
F1
RSMRST#
SUS_STAT#
L4
SUSSTAT#/GPIO25
33
R_VBIAS
6
C347
6 6
2200PF
SMBDATA SMBCLK SMBALERT#
SMBDATA
J2
SMBCLK
M1
1
+
10M
Socketed CR2032
14,26
Y3 1
26,33
2
26,33 3
C346
32.768KHZ
12PF
14,31 12PF
16,33 18,33 33 33 18,33 33 31
B
31 28 28
JP17 S TRA P (S PK R) IN No Reboot on 2nd watc hdog tim eout OUT Reboot on 2nd watc hdog tim eout
15,16 15,16 15,16
(A C_S DOUT) Forc e U freq strap to safe m ode (1111) Use U freq s trap in ICH regis ter
15,16 15,16 16 33
ICH_SPKR
JP17
20 20 20
JP13_PD
10K R187 JP14_PU
A
R209 10K
20
C15
BAT17
SDCS#1 PDCS#3
SDCS#3
L16
SDCS#3
PDA0
R12
PDA0
PDA1
T12
PDA1
PDA2
P12
PDA2
SDA0
M16
SDA0
SDA1
M15
SDA1
SDA2
L13
SDA2
PDDREQ
U11
CLK48
SDDREQ
P17
SDREQ
PDDACK#
U12
PDDACK#
SDDACK#
M13
SDDACK#
PDIOR#
R11
PDIOR#
SDIOR#
N16
SDIOR#
PDIOW#
T11
PDIOW#
SDIOW#
N15
SDIOW#
PIORDY
N11
PIORDY
SIORDY
N17
SIORDY
H2
VBIAS
RTCX1
H3
RTCX2
H4
RTCX2
H1
RTCRST#
T1
AC_RST#
RTCX1
AC_RST# AC_SYNC
T3
AC_BITCLK
R3
AC_BITCLK
AC_SDOUT
T2
AC_SDOUT
AC_SDIN0
U1
AC_SDIN0
AC_SDIN1
P3
AC_SDIN1/GPIO9
ICH_SPKR
U3
SPKR
AC_SYNC
AC97
INTEL 82801AB PART 2 IDE
LPC_SMI# LPC_PME# GPIO7 GPIO12
D11
GPIO5
E11
GPIO6
E9
GPIO7/PERR#
N4
GPIO12
GPIO13
L2
GPIO13
GPIO21
B14
GPIO21
D13
GPIO22
GPIO22
GPIO
GPIO23_FPLED
D15
GPIO26_FPLED
K4
GPIO26/SUSCLK
GPIO27
M5
GPIO27
GPIO28
L5
GPIO28
LAD0/FWH0
R6
LAD1/FWH1
U5
LAD2/FWH2
GPIO23
LAD0/FWH0 LAD1/FWH1
T5
LAD2/FWH2
LAD3/FWH3
T4
LAD3/FWH3
LFRAME#/FWH4
U4
LFRAME#/FWH4
T6
LDRQ#0
LDRQ#0 LDRQ#1
N3
LPC
LDRQ#1/GPIO8
USBP1P
R1
USBP1P
USBP1N
P2
USBP1N
P1
USBP0P
N2
USBP0N
M4
OC#1
USBP0P USBP0N OC#0
M3
USB
OC#0
Minimize Stub Length to Jumpers
19
19
CLK14
CLK66
19
SDA[2:0]
U2 A16
19
19
USBCLK ICH_3V66
19
PDA[2:0]
INTRUDER#/GPIO10
VCC3_3 20
PDCS#1
L14 U13
J4
C366
16,33
JP18 IN OUT
N1
SYSTEM
SMBALERT#/GPIO11
10M
26
N12
SDCS#1 PDCS#3
PDCS#1
U6
R197
26
1K
ICH_CLK14
C
R220
R173 C
0.1UF
INTRUDER#
VBIAS
26
A
D
RI#
J1
C294
5VREF
THERM#
1.0UF
2 RTCRST#
+
A
28
C364
2
BAT17
8.2K
CR14
28,32
1
VBATC_DLY
R203
SLP_S5#
28,32
VBATC
R219
R85
VCCSUS1
33 29,32
U14
VCCSUS2
C349
10K
G1
C
A
1K
10K
VCCRTC
R85 and R203 for Test/Debug
L1
C290
BAT17
D
2
CR11
ICH5VREF
R206
14,31
VCC5
VRTC
VCC3SBY
CR13
X3
1 VCC3_3
VCC3SBY
PART 2
C
2
VCC3SBY
PDREQ
PDD0
R10
PDD0
PDD1
N9
PDD1
PDD2
R9
PDD2
PDD3
U9
PDD3
PDD4
R8
PDD4
PDD5
U8
PDD5
PDD6
R7
PDD6
PDD7
U7
PDD7
PDD8
P7
PDD8
PDD9
N7
PDD9
PDD10
T8
PDD10
PDD11
P8
PDD11
PDD12
T9
PDD12
PDD13
P9
PDD13
PDD14
T10
PDD14
PDD15
P10
PDD15
SDD0
P15
SDD0
SDD1
R16
SDD1
SDD2
T17
SDD2
SDD3
U16
SDD3
SDD4
U15
SDD4
SDD5
R14
SDD5
SDD6
P13
SDD6
SDD7
T13
SDD7
SDD8
U14
SDD8
SDD9
T14
SDD9
SDD10
P14
SDD10
SDD11
T15
SDD11
SDD12
U17
SDD12
SDD13
R15
SDD13
SDD14
R17
SDD14
SDD15
P16
SDD15
19 19 19 19 19
C
19 19 19 19 19
PDD[15:0] 19
B
SDD[15:0] 19
A
JP18 C293 18PF
1.3 DRAWN BY:
14,26
R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
ICH0, PART 2
AC_SDOUT
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
14
OF
40
8
7
6
5
4
3
2
1
FirmWare Hub (FWH) Socket NOTE: This is a Socketed Implementation
D
D
VCC3_3
VCC3_3
C211
C355
0.1UF
0.1UF
C361
C259
0.1UF
0.1UF
VCC3_3 Distribute close to each power pin. X4 1 2
C353
C
3
C36
4
0.1UF
0.1UF
5 6 7 8
6
PCLK_6
9 10
R218
0K
R_VPP
13,17,18,24,27
PCIRST#
11 12 13 14
VCC3_3
VCC3_3
15 16
19 19
P66DETECT
18 19
JP21
WPROT
40PIN_TSOP_SKT 40
GNDA
IC
VCCA
NC3
FWH4
NC4
INIT#
NC5
RFU36
NC6
RFU35
FGPI4
RFU34
NC8
RFU33
CLK
RFU32
VCC10
VCC31
VPP
GND30
RST#
GND29
NC13
FWH3
NC14
FWH2
FGPI3
FWH1
FGPI2
FWH0
FGPI1
ID0
FGPI0
ID1
WP#
ID2
TBL#
ID3
39 38
LFRAME#/FWH4
37
INIT#
14 4,13,33
C
36 35 34 33 32 31 30 29 28
LAD3/FWH3
27
LAD2/FWH2
26
LAD1/FWH1
25
LAD0/FWH0
24
FWH_ID0
23
FWH_ID1
22
FWH_ID2
21
FWH_ID3
14,16 14,16 14,16 14,16
FGPI2_PD
R222
FGPI3_PD
20
FGPI4_PD
B
17
IC_PD
JP21 CONFIG IN Unlocked OUT Locked Default
S66DETECT
NC1
B
4.7K 1
2
3
4
1
2
3
4
TBLK_LCK 8.2K
0K
RP63
RP64 RP64 for Test/Debug 8
7
6
5
8
7
6
5
R223 4.7K
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
FIRMWARE HUB (FWH) DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_10:37 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
15
OF
40
8
7
6
5
4
3
VCC5
VCC3_3
2
1
VCC3_3
Decoupling
VCC3_3
VCC5
14
D
14,15 14,15
2
+
1
Place near VREF pin C99 2.2UF
C287 0.1UF
C246 0.1UF
C297 0.1UF
C229 0.1UF
14,15 14,15
C323
14 0.1UF
LFRAME#/FWH4
24
LAD3/FWH3
23
LAD2/FWH2
22
LAD1/FWH1
21
LAD0/FWH0
20
LDRQ#0
25
PCIRST#
13,17,18,24,27
26 27
SUSSTAT_PU
14,33 Place 1 0.1UF cap near each power pin
13,18,33 6
23 23 23 23 13,33 13,33
C 31 31
LPC_PME#
17
SERIRQ
30
PCLK_1
29
KDAT
56
KCLK
57
MDAT
58
MCLK
59
RCIN#
63
A20GATE
64
IRRX
61
IRTX
62
C356 470PF
C371
22 22
470PF
22 22 22 22 22 22
84
TXD0
85
DSR#0
86
RTS#0
87
CTS#0
88
DTR#0
89
RI#0
90
DCD#0
91
RXD#1
22 22 22
95
TXD1
96
DSR#1
97
RTS#1
22 22 22
B
RXD#0
22 22
98
CTS#1
99
DTR#1
100
RI#1
92
DCD#1
94
65
53
93 VCC3
VCC2
VCC1
VTR
VREF
U15
44
R183 4.7K
18
Super I/O
LAD3
INIT#
LAD2
SLCTIN#
LAD1
PD7
LAD0 LDRQ#
PD6
LPC I/F
PD5 PD4
LRESET#
PARALLEL PORT I/F
LPD# PME#
PD3 PD2
SERIRQ
PD1
SIO
PCI_CLK
PD0 SLCT#
LPC47B27X
KDAT
PE
KCLK
BUSY
MDAT
ACK#
MCLK
KYBD/MSE I/F
ERROR#
KBDRST
ALF# STROBE#
A20GATE
IRRX2/GP34 IRTX2/GP35
FAN2/GP32
INFRARED I/F
FAN1/GP33
RXD1
FDC_PP/DDRC/GP43
23 23 23 23 23 23 23 23 23 23 23 23
DRVDEN#1
2
DRVDEN#0
1
MTR#0
3
DS#0
5
DIR#
8
STEP#
9
WDATA#
10
WGATE#
11
HDSEL#
12
INDEX#
13
TRK#0
14
WRTPRT#
15
RDATA#
16
DSKCHG#
23
4
66
PAR_INIT#
67
SLCTIN# PDR[7:0]
75
PDR7
74
PDR6
73
PDR5
72
PDR4
71
PDR3
70
PDR2
69
PDR1
68
PDR0
21 21 21
SLCT#
77 78
PE
79
BUSY
80
ACK#
81
ERROR#
82
ALF#
83
STROBE#
54
PWM2
55
PWM1
21 21 21 21 21 21 21
C
31 31
SIO_GP43
28
TXD1 DSR1# RTS1# CTS1#
Test/Debug Header Unused GPIOs
SERIAL PORT 1
J23
DTR1# RI1# DCD1#
1
2
3
4
5
6
RXD2_IRRX TXD2_IRTX DSR2# RTS2#
SERIAL PORT 2
CTS2#
GP60/LED1
DTR2#
GP61/LED2
RI2#
GP27/IO_SMI# GP30/FAN_TACH2
DCD2#
GP31/FAN_TACH1
23
D
LFRAME#
DRVDEN1
GP25/MIDI_IN
DRVDEN0
GP26/MIDI_OUT
48
SIO_GP60
49
SIO_GP61
50
LPC_SMI#
51
TACH2 TACH1
52 46
MIDI_IN
47
MIDI_OUT
32
J1BUTTON1
33
J1BUTTON2
34
J2BUTTON1
35
J2BUTTON2
36
JOY1X
37
JOY1Y
38
JOY2X
39
JOY2Y
41
KEYLOCK#
B 14,33 31 31 23 23
MTR0# DS0#
GP10/J1B1
DIR#
GP11/J1B2
STEP#
GP12/J2B1
WDATA# WGATE#
GP13/J2B2
FDC I/F
GP14/J1X
HDSEL#
GP15/J1Y
INDEX#
GP16/J2X
TRK0#
GP17/J2Y
WRTPRT#
GP20/P17
RDATA#
GP21/P16
DSKCHG#
GP22/P12
42
SIO_GP21
43
SIO_GP22
23 23 23 23 23 23 23 23 31
A CLKI32
CLOCKS
GP24/SYSOPT
45
A
SYSOPT Pulldown on SYSOPT for IO address of 0x02E
AVSS
GND4
GND3
CLOCKI GND1
19
GND2
6
SIO_CLK14
6
R180
40
76
7
60
31
4.7K REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
SUPER I/O DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
16
OF
40
8
7
6
PCI Connector 0 (DEV Ah)
5
4
PCI Connector 1 (DEV Bh)
VCC3SBY VCC3_3
VCC12M
VCC5
VCC5
13,17,18,33 13,17,18,33 18 18
6 13,33
PTCK
17,18
13,17,18,33 17,18,27 13,17,18,27,33
PTMS
B4
A4
PTDI
B5
A5
PIRQ#A
PIRQ#D
B8
A8
PRSNT#11
B9
A9
B10
A10
B11
A11
B12
A12
B13
A13
B14
A14
B15
A15
B16
A16
13,17,18,27
B
A3
PIRQ#C
C_BE#[3:0]
13,17,18,27,33
A2
B3
A7
13,17,18,27
13,17,18,27,33
A1
B2
A6
AD[31:0]
C
PTRST#
B1
B7
PCIRST# PGNT#0
A17 A18 A19
AD31
B20
A20
AD29
B21
A21
B22
A22
AD28
AD27
B23
A23
AD26
AD25
B24
A24
B25
A25
PCI_PME# AD[31:0]
AD30
13,17,18,27,33 13,17,18,33
13,17,18,33 13,17,18,27,33 18
B26
A26
AD23
B27
A27
B28
A28
AD22
AD21
B29
A29
AD20
AD19
B30
A30
B31
A31
AD18
AD17
B32
A32
AD16
C_BE#2
B33
A33
R_AD16
R168
A4
PTDI
B5
A5
B6
A6
PIRQ#B
A7
PIRQ#D
A8
PRSNT#21
B9
A9
B10
A10
PRSNT#22
B11
A11
7,13,15,16,17,18,19,24,27 13,33
13,33
PCLK_3 PREQ#1 AD[31:0]
13,17,18,27
13,17,18,27
AD16
13,17,18,27
FRAME#
A34 A35 A36
B37
A37
B38
A38
PLOCK#
B39
A39
PERR#
B40
A40
SDONEP1
B41
A41
SBOP1
B42
A42
TRDY# STOP#
PAR
B43
A43
C_BE#1
B44
A44
AD14
B45
A45
B46
A46
AD13
AD12
B47
A47
AD11
AD10
B48
A48
B49
A49
A13
B14
A14
B15
A15
B16
A16
B17
A17
13,17,18,27,33 13,17,18,27,33 13,17,18,27,33 33
13,17,18,27,33 13,17,18,33 17,18,27 13,17,18,27,33
PCIRST# PGNT#1
A18
B19
A19
AD31
B20
A20
AD29
B21
A21
B22
A22
AD28
AD27
B23
A23
AD26
AD25
B24
A24
B25
A25
AD24
C_BE#3
B26
A26
R_AD17
AD23
B27
A27
B28
A28
AD22
AD21
B29
A29
AD20
AD19
B30
A30
B31
A31
AD18
B32
A32
AD16
B33
A33
DEVSEL#
R191
FRAME#
A34
B35
A35
B36
A36
B37
A37
B38
A38
AD17
TRDY# STOP#
B39
A39
PERR#
B40
A40
SDONEP2
B41
A41
SBOP2
SERR#
B42
A42
B43
A43
B44
A44
C_BE#1 AD14
13,17,18,27
AD15
AD12 AD10
13,17,18,33 13,17,18,33
7,13,15,16,17,18,19,24,27 13,33 13,17,18,27 13,17,18,27
C
PLOCK#
33
D
17,18,33
13,17,18,27
100
AD17
IRDY#
PCI_PME# AD[31:0]
AD30
C_BE#2
B34
13,17,18,27,33
17,18 17,18,33
A12
B13
B18
13,17,18,27
PAR
13,17,18,27,33 13,17,18,27,33 13,17,18,27,33 33 33
B
13,17,18,27
AD15
B45
A45
B46
A46
AD13
B47
A47
AD11
B48
A48
B49
A49
AD9
key
AD9
key
33
B4
B8
100
B36
AD8
B52
A52
AD7
B53
A53
B54
A54
AD6
AD5
B55
A55
AD4
AD3
B56
A56
B57
A57
AD2
B58
A58
AD0
B59
A59
B60
A60
B61
A61
B62
A62
PU1_ACK64#
PTMS
B7
C_BE#[3:0]
B35
AD1
A3
PIRQ#A
13,17,18,27
B34
A
A2
B3
PIRQ#C
AD24
C_BE#3
SERR#
17,18,33
6
B19
DEVSEL#
17,18
PTRST#
A1
B2
B12
B18
IRDY#
PTCK
17,18,33
18
B17
PREQ#0
VCC5 VCC12
J16 PCI3_CON
B6
PCLK_2
VCC12M VCC5 VCC3_3
B1
PIRQ#B
PRSNT#12
1 VCC3SBY
J17 PCI3_CON
17,18
2 VCC3_3
VCC12
VCC3_3
D
3
C_BE#0
13,17,18,27
B52
A52
AD7
B53
A53
B54
A54
AD6
B55
A55
AD4
AD5 AD3 AD1
33
PU1_REQ64#
C_BE#0
AD8
PU2_ACK64#
B56
A56
B57
A57
AD2
B58
A58
AD0
B59
A59
B60
A60
B61
A61
B62
A62
PU2_REQ64#
13,17,18,27
33
A
33
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
PCI CONNECTORS 1 AND 2 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
17
OF
40
8
7
6
PCI Connector 2 (DEV 6h)
5
4
3
2
VCC3_3
VCC12M
VCC5
VCC5
VCC12
VCC3_3
J22 PCI3_CON
17,18
D
PTCK
13,17,33 18 14,33 18
A1 A2
B3
A3
PTMS
B4
A4
PTDI
A6
PIRQ#C
B7
A7
PIRQ#A
PIRQ#B
B8
A8
PRSNT#31
B9
A9
B10
A10
B11
A11 R_GNT#A
R185
B12
A12
0K
GPIO21 PRSNT#32
R194 0K
R_GPO21
For Debug Only
B13
A13
R_SERIRQ
B14
A14
For Debug Only
B15
A15
6 13,33
B16
A16
B17
A17
B18
A18
B19
A19
AD31
B20
A20
AD29
B21
A21
SERIRQ 0K PCLK_4 PREQ#2 AD[31:0]
13,17,18,27
C
13,17,27,33 13,17,27,33 13,17,33 17,18,27
B
13,17,27,33
5.6K
AD28 AD26
AD25
B24
A24
PCI_PME# AD[31:0]
A25
AD24
A26
R_AD22
AD23
B27
A27
B28
A28
AD22
AD21
B29
A29
AD20
AD19
B30
A30
B31
A31
AD18
AD17
B32
A32
AD16
C_BE#2
B33
A33
B34
A34
B35
A35
B36
A36
DEVSEL#
B37
A37
B38
A38
PLOCK#
B39
A39
PERR#
B40
A40
SDONEP3
B41
A41
SBOP3
B42
A42 A43 A44 A45
PRSNT#22 PRSNT#21 PRSNT#12
17
7,13,15,16,17,19,24,27
PRSNT#11
0K R192
13,33 13,17,27
0K Do Not Stuff R192
PCI_REQ#A
13,33
C336
C337
C267
C284
C335
C342
For Debug Only 0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
13,17,18,27
C
B26
B45
PRSNT#31
17
17
B25
B44
13
R193
AD30
A23
B43
PRSNT#32
18 17
PGNT#2
A22
AD14
13,17,27,33
For Debug Only
PCIRST#
B23
C_BE#1
13,17,33
VAUX3
B22
SERR#
D
R190
17,33
18
AD27
IRDY#
5.6K PTCK
17,18
17,33
VCC3SBY PCI_GNT#A
C_BE#3
C_BE#[3:0] 13,17,27
R189
PTRST#
17,18
17,18
A5
B6
PIRQ#D
R195 13,16,33
PTRST#
B1 B2
B5
13,17,33
1
Layout Note: Should be in Slot 0 Position (Outside Edge of Board Furthest from U)
R167
AD22
13,17,18,27
100
FRAME# TRDY# STOP#
PAR
13,17,27,33 13,17,27,33 13,17,27,33
JP19
33
17,18,27
33
B46
A46
AD13
B47
A47
AD11
AD10
B48
A48
B49
A49
1
PERR#_PU
3
GPIO7
33
B
2
14,33
13,17,27
AD15
AD12
PERR#
JP19 - ICH/ICH0 Compatibility 1-2 ICH0 Default 2-3 ICH
AD9
key
B52
A52
AD7
B53
A53
B54
A54
AD6
AD5
B55
A55
AD4
AD3
B56
A56
AD1
A 33
PU3_ACK64#
C_BE#0
AD8
B57
A57
AD2
B58
A58
AD0
B59
A59
B60
A60
B61
A61
B62
A62
13,17,27
A PU3_REQ64#
33
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
PCI CONNECTOR 3 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
18
OF
40
8
7
6
5
4
3
2
1
ULTRAATA/33 IDE CONNECTORS VCC5
PRIMARY IDE CONN.
VCC5
D PDD[15:0]
14 R133 PCIRST_BUF#
R100
J15
1K
R140 33
R_RSTP#
1
2
PDD7
3
4
PDD8
PDD6
5
6
PDD5
7
8
9
PDD4
14 14 14 14
C
14 13,33
14 31
D
SDD[15:0]
14
19
SECONDARY IDE CONN.
J12
1K
R139
PCIRST_BUF#
R_RSTS#
1
2
SDD7
3
4
SDD8
PDD9
SDD6
5
6
SDD9
PDD10
SDD5
7
8
SDD10
9
19
33
10
PDD11
SDD4
10
SDD11
PDD3
11
12
PDD12
SDD3
11
12
SDD12
PDD2
13
14
PDD13
SDD2
13
14
SDD13
PDD1
15
16
PDD14
SDD1
15
16
SDD14
PDD0
17
18
PDD15
SDD0
17
18
SDD15
19
20
19
20
PDREQ
21
22
SDREQ
21
22
PDIOW#
23
24
PDIOR#
25
26
PIORDY
27
28
PDDACK#
29
30
IRQ14
31
32
PDCS#1 IDEACTP# PDA[2:0]
PDA1
33
34
PDA0
35
36
37
38
39
40
14 For Host-Side 80-Conductor Cable Detection: Populate R96 and R221, DePopulate C187 For Drive-Side 80-Conductor Cable Detection: Populate C187, DePopulate R96 and R221
PRI_PD1
14 14 14 14 13,33
R96
P66DETECT
R_P66DET
23
24
25
26
SIORDY
27
28
SDDACK#
29
30
IRQ15
31
32
15
0K PDCS#3
14
14
31
PDA2
14
SDIOW# SDIOR#
14
R135
R138
R101
5.6K
10K
470
SDCS#1 IDEACTS# SDA[2:0]
33
34
SDA0
35
36
37
38
39
40
For Host-Side 80-Conductor Cable Detection: Populate R94 and R95, DePopulate C186 For Drive-Side 80-Conductor Cable Detection: Populate C186, DePopulate R94 and R95 R95
S66DETECT
R_S66DET
C
15
0K SDCS#3
14
SDA2
C187 R221 0.047UF
SDA1
PRI_SD1
R134
R137
R132
5.6K
10K
470
C186 R94
0.047UF
15K
15K
VCC3_3
B
B VCC3_3
R141 U11
8.2K
13,17,18,24,27
14
VCC
PCIRST#
5
PCIRST_BUF#
6
19
7 GND SN74LVC07A
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
ULTRAATA/33 CONNECTORS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_10:37 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
19
OF
40
8
7
USB Connectors
6
5
4
1
Do Not Stuff AC97_USB- R149 0K
2
26 POLYSWITCH RUSB250
F3
AC97_USB+
26
2.5A
R148 0K
D 1
D
2
VCC5
VCC3_3
R147 330K
3
L23 USBV5
1
2
1
C202
+
AC97_OC#
26
C12
68UF
0.1UF
2
R146 0K
R72 470K
Do Not Stuff
USBV0
14
C124 .001UF
R13
R_USBP0N
15
0K R205
USBP0P
14
USBD0N R15
R_USBP0P
15
R201 560K
USBD0P
0K USBG0 R14
15K
15K
47PF
47PF
C
R11 C359
C348
2
OC#0
14
R204
USBP0N
C15 L11
USB-CON2 1 1
Place R204, R205, C348, and C359 within 1" of ICH0
2 3 4 5
L9 1
C
J3
470PF
6 2
7 8
VCC1 DATA1DATA1+ GND1 VCC2 DATA2DATA2+ GND2
1
C9
+
C201 68UF
2 - USB Stacked
0.1UF
2
USBV1 R214
USBP1N
14
USBD1N
15
B
R211 15
USBP1P
14
USBD1P
B
USBG1
C358
C357
47PF
R12
R63
C13
15K
15K
47PF
C8 C16
47PF
C98
2
47PF
47PF
C14
47PF
Place CAPs as close as possible to connector.
L10
470PF 1
Place R214, R211, C357, and C358 within 1" of ICH0
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
USB CONNECTORS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
20
OF
40
8
7
6
5
4
3
2
1
Parallel Port Header
D
D
VCC5
CR1 A
C
PARV5
8
7
6
5
3
4
RP13 2.2K
2
6
5
7
8
6
7
RP17 2.2K
1
RP28 2.2K
R224
5
8
6
7
5
8
1N4148
RP14 2.2K
16
4
3
2
1
4
3
2
1
4
3
1
C
2
2.2K
C
ERROR# RP16
16 16 16 16
16
SLCTIN#
1
8
R_SLCTIN#
PAR_INIT#
2
7
R_PARINIT#
ALF#
3
6
R_ALF#
STROBE#
4
5
R_STROBE#
PDR[7:0]
33 RP15
J5
PDR0
1
8
R_PDR0
PDR1
2
7
R_PDR1
PDR2
3
PDR3
6
4
2
3
4
5
6
7
8
R_PDR3
9
10
R_PDR2
5
33 RP27
B
1
PDR4
1
8
R_PDR4
11
12
PDR5
2
7
R_PDR5
13
14
PDR6
3
6
R_PDR6
15
16
PDR7
4
5
R_PDR7
17
18
19
20
21
22
23
24
25
26
33
BUSY
180PF
180PF
C91
C97
C94
C90
C89
C95 180PF
180PF
180PF
C93
180PF
C190
C88
180PF
C193
C92
180PF
180PF
C196
C96
C189
180PF
C192
180PF
C194
180PF
SLCT#
180PF
PE
180PF
16
180PF
C197 16
180PF
16
ACK#
180PF
16
B
J5 Pinned Out for IDC (Flow Through) Ribbon Cable Connector
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
PARALLEL PORT DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_11:02 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
21 OF
40
8
7
6
5
4
3
2
1
Serial Port/COM Headers VCC12VCC5
VCC12 J19 and J21 pinned out for IDC (Flow Through) Ribbon Cable Connector U17
D
D 16 16 16 16 16 16 16 16
DCD#0
19
RXD#0
18
DSR#0
17
DTR#0
16
TXD0
15
CTS#0
14
RTS#0
13
RI#0
12 11
VCC
VCC12
RY0
RA0
RY1 RY2 DA0 DA1
GD75232
20
RA1 RA2 DY0 DY1
RY3
RA3
DA2
DY2
RY4
RA4
GND
VCC-12
1 2
DCD#0_C
3
RXD#0_C
4
DSR#0_C
1
2
5
DTR#0_C
3
4
6
TXD#0_C
5
6
7
CTS#0_C
7
8
8
RTS#0_C
9
10
9
RI#0_C
J21
10
C325
C327
C329
C368
100PF
100PF
100PF
100PF
COM1 and COM2 are 2x5 pin Headers for a cabled port. VCC3SBY C326
C328
C330
C369
100PF
100PF
100PF
100PF
Place Close to Header
C
C R230
10K RI#_CR_C
3
2
ICH_RI#
D
R227
Q10 3
2N7002LT1
1
47K
G ICHRI#_C
2
VCC5 R229
If not populated at all, remove CR14 and short RI#0_C to RI#CR
VCC12
C374
47K
U16
1.0UF 20
16 NOTE: If Wake from S3 on Serial Modem is not ed do not stuff CR15 and Q10.
B
2nd COM Header Option
VCC12-
S
16 16 16 16 16 16 16
DCD#1
19
RXD#1
18
DSR#1
17
DTR#1
16
TXD1
15
CTS#1
14
RTS#1
13
RI#1
12 11
VCC
VCC12
RY0
RA0
RY1 RY2 DA0 DA1
GD75232
14
CR15 BAT54C 1
RA1 RA2 DY0 DY1
RY3
RA3
DA2
DY2
RY4
RA4
GND
VCC-12
1 2
DCD#1_C
3
RXD#1_C
4
DSR#1_C
1
2
5
DTR#1_C
3
4
B
J19
6
TXD#1_C
5
7
CTS#1_C
7
8
8
RTS#1_C
9
10
6
RI#1_C
9 10
C316
C314
100PF
C315
100PF
C311
100PF
100PF
C312
C313
C309
C310
100PF
100PF
100PF
100PF
Place Close to Header
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
SERIAL AND GAME PORTS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_11:02
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
22
OF
40
8
7
6
5
4
3
KEYBOARD/MOUSE PORTS
VCC5
L3
F2 2 1 PS2V5_F
1
FLOPPY DISK HEADER
VCC5
1
2
PS2V5
2
1.25A
D
D 6
7
5
8
RP31
RP1 4.7K 4
KCLK
1
4 5
L_KCLK
2
R143 1K
16
6 L7 MDAT
1
16
7
L_MDAT
2
17
9 L6 1
10 2
11
L_MCLK
PS/2 Mse
8
MCLK
5
J1 1
L_KDAT
2
L4
16
6
1K
PS/2 Kybd
3
2
1
1
3
C
7
STACKED PS2 CONNECTOR
2
16
2
4
L5
16
8
3
KDAT
16
1
16
PS2GND
16
16 15
16
14
12
13 16
C4
C5
C2
C1
470PF
470PF
470PF
470PF
0.1UF
16 L1
2
C3
16 16 16
PS2_PD 2
1
16
L2
16 16
J14 1
4
3
DRVDEN#1
6
5
INDEX#
8
7
10
9
MTR#0
12
11
14
13
16
15
DIR#
18
17
STEP#
20
19
WDATA#
22
21
WGATE#
24
23
TRK#0
26
25
WRTPRT#
28
27
RDATA#
30
29
HDSEL#
32
31
DSKCHG#
34
33
DS#0
C
1
16
2
DRVDEN#0
GAME PORT HEADER J7 Pinned Out for IDC (Flow Through) Ribbon Cable Connector RP29 VCC5
B
R_JOY1X
1
8
JOY1X
R_JOY1Y
2
7
JOY1Y
R_JOY2Y
3
6
JOY2Y
R_JOY2X
4
5
JOY2X
16
B
16 16 16
2.2K
1
3
5
7
9
11
13
15
2
4
6
8
10
12
14
16
VCC5 VCC5
C199
C198
C191
C195
0.01UF
0.01UF
0.01UF
0.01UF
7
6
5 4
4.7K
3
4.7K
2
R178
8
R89
1
J7
RP30 1K
J1BUTTON1 J1BUTTON2 J2BUTTON2 J2BUTTON1
A 16
R88
MIDI_OUT MIDI_IN
16 16 16
A
R_MIDIOUT
47 16
16
R179
C179
C178
C79
C182
47PF
47PF
47PF
47PF
R_MIDIIN
47 C177
C176
470PF
470PF
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
KEYBOARD/MOUSE/FLOPPYGAME PORTS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_11:02 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
23
OF
40
8
7
Digital Video Out
6
5
4
3
2
1
VCC3_3 L26 2
1 FPP1V3
+
VCC3_3
2
10UF
100PF
100PF
D
1
C281
C275 C280 VCC3_3
D
L25 FPDV3 24
2
1
+ 2
C230 10UF
100PF
C271 C272 100PF
100PF
C231
100PF
C276 C277 100PF
+
C282 2
VCC1_8
1
FPAV3 1
1 L27
10UF
2
VCC1_8
R116
1K
FTVREF
38 39 40 41 42 43 44 45 46
FTD[11:0]
47
9 FTD11
50
FTD10
51
FTD9
52
FTD8
53
FTD7
54
FTD6
55
FTD5
58
FTD4
59
FTD3
60
FTD2
61
FTD1
62
FTD0
63
FTCLK0
56
FTCLK1
57
1
12
D22
TXC-
D21
TXC+
FLAT TRANSMITTER SII154
D18
D16/PFEN D15
TX0TX0+
D14
TX1-
D13
TX1+
D10
TX2-
D9
TX2+
EXT_RS
D7
TX0+
27
TX1-
28
TX1+
30
TX2-
31
TX2+
25 25
25 25
25 25
19 EXTRS_PU
D5
DKEN/RST
D4
TEST
D3
BSEL/SCL
D2
DSEL/SDA
D1
ISEL
D0
MSEN
EDGE/CHG
IDCLKIDCLK+
CTL1/A1/DK1 DE CTL2/A2/DK2 HS CTL3/A3/DK3
PCIRST#
35 34
B 13,17,18,24,27
TEST_PD
15
3VFTSCL
14
3VFTSDA
9,24,25 9,24,25
13
SL_STALL
11
9,24
10
3VHTPLG
9 8
A1_PD
7
A2_PD
6
A3_PD
25
GND0
R121
R118
R113
16
GND1 48
64
32
GND2
VS PGND
5
TX0-
25
25
D6
17
4
FTVSYNC
24
25
D8
AGND0
FTHSYNC
TXC+
D11
AGND2
9,24
2
22
D12
AGND1
9,24
FTBLNK#
TXC-
D19
D17
20
9,24
21
D20
26
9,24
Do Not Stuff R126
C
PD
9,24
4.7K
400
1%
VCC0
VCC1
18
49
23
33 VCC2
PVCC0
PVCC1
29
D23
AVCC0
3
AVCC1
100PF
36 37
B
R126 R165
VREF
C228
1K
0.01UF
C
R122
24
Place C226 near U28, pin 3 U7 C226
1K
1K
1K
Do Not Stuff
A
A
R124 R124 is for Test Only TEST pin may be tied direct to GND
4.7K FPDV3 24
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
DIGITAL VIDEO OUT DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:13
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
24
OF
40
8
7
6
5
4
3
2
1
Video Connectors VGA Connector
20 Pin Flat Connector
D
VCC5
VCC5
D
2
BLM11B750S is rated at 75Ohms at 100MHz
L21 VCC5
1
1
11
TX2+
TX1-
2
12
TX2-
3
13
4
14
5
15
24
16
7
17
8
18
3.3PF
1K
CR7
1 BAT54S
+
R74 1K
L12
J6
3
CR10
6
24
L_RED R75
Place R66,R67,&R69 Close to VGA Connector
5VHTPLG 25
2.2K
C203
VID_GREEN
9
C200
L_GREEN
2
2
75 1%
C105
C106
3.3PF
3.3PF
0K
5VFTSCL 0K
1 BAT54S
24,25
L_HSYNC
3
CR9
24,25
25 25
2
8
L_BLUE FUSE_5
5VFTSDA
C
3 13 9
MON2PU
4
L_VSYNC
14 10
5VDDCDA
5
R71
5VHSYNC
11
12
BLM11B750S
R67
Populate if DFP Device is also populated.
R103
6 1
11 7
1
VCC1_8
2
R105
1
MONOPU
L20
De-Bounce Circuit +
C
A
CON_HTPLG
CON_FTSCL
19 20
2
3.3PF
2.5A
-
1
9 10
TX0-
Protection Circuit for 20V Tolerance
C111
1
6
24
0.01UF
TXC-
24
TX0+
CON_FTSDA
TXC+
1N5821
C
24
R69 75 1%
24
C109
2
24
TX1+
R65
BLM11B750S
10UF
24
F1
2
VCC1_8
J8
1 CRT5V_F
VID_RED
9
10 5
15
15
0K
VCC5 VCC5
C122
C119
3.3PF
3.3PF
2
CR4 C
25
4.7K
R115
0.1UF
2.2K
C227
6
7
RP34
A 1N4148
5
8
QS4_3V
5V to 3.3V Translation/Isolation
1 BAT54S
25
Do Not Stuff C119 and C122
CR5
5VDDCCL
R64
5VVSYNC VCC5
QST3384 24
VCC
9 9 9 9 24 9,24 9,24 6 6
3VDDCDA
3
3VDDCCL
4
CRT_HSYNC CRT_VSYNC
7 8
3VHTPLG
11
3VFTSDA
14
3VFTSCL
17
CK_SMBDATA
18
CK_SMBCLK
21 22 1 13
1A1
1B1
1A2
1B2
1A3
1B3
1A4
1B4
1A5
1B5
2A1
2B1
2A2
2B2
2A3
2B3
2A4
5VDDCDA
5
5VDDCCL 5VHSYNC 5VVSYNC
9
5VHTPLG
10
R119
19 QSSDA 20 QSSCLR120
2B5
BEA#
GND
3.3PF
B
0K
C112
1 BAT54S
25
3
L19
25
9
25
VID_BLUE
1
R66 75 1%
24,25 11,12,14,28,33
SMBCLK
2
C101
10PF
C104
C103
10PF
3.3PF
3.3PF
2
11,12,14,28,33
0K
10PF C116
BLM11B750S
VCC1_8
24,25
SMBDATA
C208
10PF Do Not Stuff C100 and C102
CR6
25
5VFTSCL
16
2A5
25
5VFTSDA
15
23
C100
3.3PF 2
2
6
2B4
0K C102
4
3
2
1
B U6
3
1 BAT54S
3
12
CR8
BEB#
A
A
2.2K
R59 2.2K REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
R58 Do Not Populate
1.3
VIDEO CONNECTORS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
25
OF
40
8
7
6
5
4
3
2
1
AUDIO/MODEM RISER
D
D
VCC12 VCC5
VCC12-
VCC3_3
VCC5 VCC3SBY
J18
B1 B2
31
AC97SPKR
B3 B4 B5 B6
C
B7 B8 B9 B10 B11
AUDIO_MUTE# GND[0]
AUDIO_PWRDWN MONO_PHONE
(ISOLATED)
MONO_OUT/PC_BEEP
RESV[5]
RESV[1]
RESV[6]
RESV[2]
RESV[7]
PRIMARY_DN#
GND[7]
-12V
+5VDUAL/5VSBY USB_OC
GND[1]
GND[8]
+12V GND[2]
USB+
+5VD
USB-
AC’97_RISER
KEY
B13 B14 B15 B16
14 14
AC_SDOUT
B17
AC_RST#
B18 B19 B20 B21 B22 B23
A2 A3 A4 A5 A6
C
A7
AC97_OC#
A8
20
A9 A10
AC97_USB+
A11
AC97_USB-
20 20
KEY
AMR_CONNECTOR
KEY B12
A1
KEY
GND[3]
GND[9]
RESV[3]
S/P_DIF_IN
RESV[4]
GND[10]
+3.3VD
+3VDUAL/3VSBY
GND[4]
GND[11]
AC97_SDATA_OUT
AC97_SYNC GND[12]
AC97_RESET# AC97_SDATA_IN3
AC97_SDATA_IN1
GND[5]
GND[13]
AC97_SDATA_IN2
AC97_SDATA_IN0 GND[14]
GND[6] AC97_MSTRCLK
AC97_BITCLK
A12 A13 A14 A15 A16
AC_SYNC
A17
14
A18
AC_SDIN1
A19
14,33
A20
AC_SDIN0
A21
14,33
A22
AC_BITCLK
A23
B
14
B
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
AUDIO/MODEM RISER DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
26
OF
40
8
7
6 VCC5
LAN
LAN Decoupling Distribute aroung Power Pins Close to 82559. VCC3SBY
C261
C184
C165
0.1UF
0.1UF
0.1UF
VCC3SBY
C180 0.1UF
C257 0.1UF
VCC3SBY
1
C255 +
2
2
+
1
C
4.7UF
Place C68/C255 Close to Ball A10
3
2
1
VCC3SBY
C_BE#[3:0]
13,17,18,33 13,17,18,33 13,17,18,33 13,17,18,33 13,17,18,33 13,17,18,33 17,18 13,17,18,27 13,33 13,33 7,13,15,16,17,18,19,24 6
L9
L5
L4
K11
K10
K9
K8
K7
K6
K5
K4
J11
J10
J9
J8
J7
J6
J5
H8
H7
H6
H5
G6
G5
E12
L10 VCC[25]
VCC[24]
VCC[23]
VCC[22]
VCC[21]
VCC[20]
VCC[19]
VCC[18]
VCC[17]
VCC[16]
VCC[15]
VCC[14]
VCC[13]
VCC[12]
VCC[11]
VCC[10]
VCC[9]
VCC[8]
VCC[7]
VCC[6]
VCC[5]
VCC[4]
VCC[3]
VCC[2]
VCC[1]
VCC[0]
N6
K3
E1
A7
A3
P2 VCP[5]
VCP[4]
VCP[3]
VCP[2]
VCP[0]
VCP[1]
A11 VCT
N8
P12 VCL[3]
K13
AD1
P6
AD2
LILED
A12
LILED
AD3
P5
AD3
ACTLED
C11
ACTLED
AD4
N5
AD4
SPEEDLED
B11
SPEEDLED
AD5
M5
AD5
TDP
C13
TDP
AD6
P4
AD6
TDN
C14
TDN
AD7
N4
AD7
RDP
E13
RDP
P3
AD8
RDN
E14
RDN
AD9
N3
AD9
SMBALRT#
B10
AD10
N2
AD10
CSTSCHG
C5
AD11
M1
AD11
PME#
A6
AD12
M2
AD12
FLA0/PCIMODE#
J13
AD13
M3
AD13
FLA1/AUXPWR
J12
28
28
PCI_PME#
13,17,18
R164
LANAPWR
3K
AD14
FLA2
K14
L2
AD15
FLA3
L14
AD16
FLA4
L13
AD17
E3
AD17
FLA5
L12
AD18
D1
AD18
FLA6
M14
AD19
D2
AD19
AD20
D3
AD20
AD21
C1
AD21
AD22
B1
AD22
AD23
B2
AD23
AD24
B4
AD24
AD25
A5
AD25
FLA13/EEDI
P10
EEDI
3
FLA7
M13 N14
FLA9/MRST
P13
FLA10/MRING#
N13
FLA11/MINT
M12
FLA12/MCNTSM#
M11
82559
VCC3SBY
U18
B5
AD26
FLA14/EEDO
N10
EEDO
4
B6
AD27
FLA15/EESK
M10
EESK
2
AD28
C6
AD28
FLA16
P9
AD29
C7
AD29
FLD0
F14
AD30
A8
AD30
FLD1
F13
AD31
B8
AD31
FLD2
F12
FLD3
G12
C_BE#0
M4
C/BE0#
FLD4
H14
C_BE#1
L3
C/BE1#
FLD5
H13 FLD5_PD
C_BE#2
F3
C/BE2#
FLD6
H12 FLD6_PD
C_BE#3
C4
C/BE3#
FLD7
J14
EECS
P7
F2
FRAME#
FLCS#
N9
IRDY#
F1
IRDY#
FLOE#
M8
FLWE#
M9
TRDY#
G3
TRDY#
DEVSEL#
H3
DEVSEL#
STOP#
H1
STOP#
J1
CLKRUN# TEST
PAR
TCK
D14
INTA#
PERR#
J2
PERR#
TI
SERR#
A2
SERR#
TO
AD20
R153
PREQ#3
100
IDSEL
RBIAS10
C3
REQ#
RBIAS100
B13 RBIAS100
PGNT#3
J3
GNT#
VREF
PCIRST#
C2
RST#
NC11
PCLK_5
G1
CLK
NC10
LAN_ISOLATE#
B9
ISOLATE#
NC8
LAN_RST#
A9
ALTRST#
NC7 NC6
C9
SMBCLK
NC5
SMBD
NC4 NC3
VIO
G2
VIO
N11
X1
P11
X2
NC2
A
25MHZ
22PF
22PF
R163 619 EECS
R154 62K
B
R152 4.7K
R156 549
R155 619
C12 D10 G4 A14 J4 L7 P1 D9 L8 P14 H4 A1
A
VSS[31]
VSS[30]
VSS[29]
VSS[28]
VSS[27]
VSS[26]
VSS[25]
VSS[24]
VSS[23]
VSS[22]
VSS[21]
VSS[20]
VSS[19]
VSS[18]
VSS[17]
VSS[16]
VSS[15]
VSS[14]
VSS[13]
VSS[12]
VSS[11]
VSS[10]
VSS[9]
VSS[8]
VSS[7]
VSS[6]
VSS[5]
VSS[4]
VSS[3]
VSS[2]
VSS[1]
VSS[0]
VSSPP[5]
VSSPP[4]
VSSPP[3]
VSSPP[2]
VSSPP[1]
VSSPP[0]
VSSPT
VSSPL[3]
VSSPL[2]
VSSPL[1]
619
L6
L11
H11
H10
H9
G11
G10
G9
G8
G7
F11
F10
F9
F8
F7
F6
F5
F4
E11
E10
E9
E8
E7
E6
E5
E4
D11
D8
D7
D6
D5
D4
N1
M6
K2
E2
B7
B3
C10
N12
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
LAN
0.1UF R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
7
6
Do Not Stuff R162
DRAWN BY:
8
7
C265 P8
C269
G14
C331
K12
LAN_XTAL2
VSSPL[0]
NC1 LAN_XTAL1
NC1
EECS
D12
B14 RBIAS10
A10
NC2
EESK
B12
A4
R_LANIDS
EEDO
5
A13 LAN_TEST D13
VCC EEDI
GND
C8 LANCLKRUN
TEXEC
H2
1
C
8
93C46
AD27
FRAME#
Y2
28
L1
L_SMBD
28
28
K1
FLA8/IOCHRDY
D
28
AD16
L_SMBCLK
28
28
AD15
NC9
28
28
28
AD8
PIRQ#A
13,17,18,33
VCL[2]
G13
AD0
M7
PAR
13,17,18
VCL[0]
N7
AD2
AD26
4.7UF
13,17,18
B
4
VCC3SBY
AD1
AD14
0.1UF
C68
5%
AD0
VCL[1]
U13
4.7K AD[31:0]
13,17,18
C334
VCC3SBY
VCC3SBY R159
D
5
VCC3SBY
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
27
OF
40
8
7
6
5
4
3
2
1
VCC3SBY
LAN
VCC3SBY
R111 330
D
27
TDN
12
27
RDP
9
27
RDN
7
5
14
SPEEDLED
JP7
JP11
JP12
27,28
27,28 27,28
RJ-8
TDC
SPEEDLED
8
11 TDC
27,28
LILED ACTLED
C
TXC_PD
RXC_PD
C
RDC
27,28
RDC
TXC 1
C268 0.1UF
RJ78_PD
C266 0.1UF
330
27,28
RJ-7
4
RJ45_PD
Do Not Stuff
RD_PD
LILED
330
13
RJ-5
3 TD_PD
ACTLED
330
RJ-4
6
SHLD2
R161 50
RJ-45
RD-
SHLD1
R160 50
330
RXC
R158 50
R112
LI_CR
16
RD+
18
R157 50
15
TD-
2
Place Termination near 82559
RJMAG
R145
JP23_PU
TD+
17
27
10
R144
JP18_PU
J9 TDP
R108
JP7_PU
ACT_CR
D
R107
R110
R106
R109
75
75
75
75
C213
C212
0.1UF
0.1UF
Do Not Stuff RJMAG_CONN
VCC3SBY C210 Default Config: Do Not Stuff For EST Testing
470PF-1500V
Note: Chassis Ground, use plane for this signal R215 4.7K
Note: Chassis Ground, use plane for this signal
11,12,14,25,33
JP8
SMBCLK
1
GPIO27
3
2
14
JP8_SMBC
R151
L_SMBCLK
0K
27
B
B
VCC3SBY
Select JP8/JP9 ICH0 1-2 Default ICH 2-3 14
SUS_STAT#
R210
R186 4.7K
0K
14,29,32
PWROK
JP9
LAN_ISOLATE#
27
R198
11,12,14,25,33
1
GPIO28
3
2
0K
14
Do Not Stuff R198
RSMRST#
JP9_SMBD
R150
L_SMBD
0K
27
LAN DISABLE - JP10 Normal 1-2 Default Disable 2-3
JP10 14,32
SMBDATA
1
LAN_RST#
2
A
27
A
3
Note: This circuit is for debug purpose only.
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
LAN DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
28
OF
40
8
7
6
5
Voltage Regulators
4
VCC3_3
3
V3SB
2
1
VCC3SBY
1N5822 C
A NDS356AP
D
G
S
S
D
47UF D
2
47UF
CR2
C75
+
2
This generates 3.3V Standby Power which is on in S0,S1,S3,S4,&S5. It es 3.3V from the ATX supply in S0/S1, and 3.3VSB (generated by VR2 below) in S3/S4/S5.
1
1
C174
+
VCC 3.3V Standby VOLTAGE SWITCH D
G
Q5 Do Not Populate C375
1
1
C173 +
1200UF
1200UF
G
2
2
D
S
S
D
VCC12
R61
Q6 G
VCC5SBY
+
NDS356AP
4.7K SN74LVC07A has 5V input and output tolerance.
VCC5SBY
Q9
VCC3SBY
SI4410DY
R87 PLANE_CTL1
10K
14,32
2
PCTL_IN
VCC
1
2
PLANE_CTL0
7
R83
3 B
V_GQ6
0K
7
28,32
3
PWROK
Q7
U5
VCC
14
C
14
1 2
GND
GND
5
3
6
2
7
1
8
C MMBT3904LT1
U4 74LS132 1
SLP_S3#
4
SN74LVC07A
VTT 1.5V VOLTAGE REGULATOR VCC3_3
C
VTT1_5
VR5
E
Q8
LT1587-1_5
SI4410DY 4
5
3
3
VOUT
2
ADJ
1
VIN
6
C225
2
2
100UF-TANT
C270
+
C43 1.0UF
+
100UF-TANT
8
1
7
1
1
2
B
B
VCC 3.3VSB Regulator
VCC 1.8 VOLTAGE REGULATOR
VCC5SBY
V3SB
VCC 2.5 VOLTAGE REGULATOR VCC1_8
VCC3_3
VCC5
VCC2_5
VR2
VR3
LT1587ADJ
LT1587ADJ VOUT
IN
OUT
3
2
301
VOUT 3
VR1_ADJ
100UF-TANT
100UF-TANT
1%
130
ADJ
1
VR5_ADJ
C65
2
1.0UF
240
R57
C74
1%
0.1UF
Place C159 at the Regulator
240
2
R54
R56 1%
+
C57
2
VIN
+
C59 2
2
2
Place C76 at the Regulator
1
+
+
C76
+
1
C159
1
1
1
1
1 22UF-TANT
1%
VIN ADJ
GND
C71
R55
100UF-TANT
3
2
22UF-TANT
VR4 LT1117-3_3
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
VOLTAGE REGULATORS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
29
OF
40
8
7
6
5
4
3
Processor Voltage Regulator
VCC3_3
2
1
VCC5
VCC12 VCC5 R33
R18
220
5.6K
R22
L8
1.0UH-6.8A
D
VRM_PWRGD
5.1
D 32
C21 5VIN
1.0UF 1
1200UF
2
1200UF
C7 +
1
C29 +
+
2
1200UF
C26
1
1
C30
2
10UF
2
2
0.1UF
10K
+
C22
+
C27
1
R17
1200UF
R20
PV12 5
2 PVCC
8
D2
D1
S3
S2
S1
4
3
2
1
6
7
G1
1
D3
2
D4
S1
6
D1
5
8
SENSE
C
0.8UH-20A
3
GND
1.0UF
20
4
SGND
VFB_PD
S2
3
1
VCC
2
G2
11
S3
SS
S1
Q1 SI4410DY
S2
1.0UF
VCCVID
L14
G1
4
D1
Close to FETs C25
L_VCCVID
D2
COMP
D2
1
R19
D3
9
8
3
R_VCCVID
D4
VFB
G1
8
7
10
7
4
G2
FAULT#_PU
20
6
Q3 SI4410DY
Q4 SI4410DY
R16
JP5 C18 150PF
R_VRCOMP
JP4
S3
VID4
12
SS_PD
JP3
G1
IFB
VRCOMP_PD
JP2
D3
G1
VID3
LTC1753
D4
FAULT#
VID2
5
The LTC1753 incorporates internal pull-ups on VID[4:0]. If your VR IC does not incorporate these, they must go on the motherboard.
6
14
5
8
0K
Place CAPs C24
13
PWRGD
VID1
1
15
S1
16
R_VID3
Q2 SI4410DY
17
R_VID2
D1
1
R_VID1
8
7
2
6
2
IMAX
3
3
VID0
4
VID3
OUTEN
S2
VID2
5
18
IMAX
S3
VID1
4
R_VID0
7
G1
C
19
D2
VID0
OUTEN
D3
RP4
D4
VID[3:0]
3
7
0.01UF
VR1
6
2.7K
5
C20
8.2K C17
C19 C35
0.01UF 0.1UF 220PF
B
B
VID Override Jumpers
1 + 2
+ 2
C54 2700UF
1
C128 2700UF
2
+
1
C28 2700UF
1 2
2700UF
+ 2
0.1UF
2700UF
Do Not Stuff C147
C58 +
C31
1
C147
Refer to VR Supplier for Layout Guidelines
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
VRM 8.4 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
2-22-1999_11:02 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
30
OF
40
8
7
6
5
4
3
2
1
VCC5
VCC3_3
1M
R225
16V
1
PWRBTN#
14
+
C292 2
C279
R226
D
10UF
No stuff. For test only
ICH has internal pullup and debounce on PWRBTN#
100K
R217
VCC3SBY
SYSTEM
D
0.1UF 0K
No stuff. For test only
VCC5
VCC5
16
C370
16
1.0UF
1
R212
IRTX
SW2
VCC3_3
VCC3_3
VCC3_3
2
3
4
2 R_IRTX 3
82
R213
1
J20
IRRX
INFRARED
4
4.7K
5
KEY
6
PBSWITCH
7 PBTN_IN 8
POWER SW.
9
R228
10
R93 10K
470
R231
IDEACTP#
19
11 12
U11
10K
VCC 14
R136 10K
3
13
IDE_ACTIVE
4
KEY
H.D. LED
14 7 GND
VCC
C
IDEACTS#
19
14
SN74LVC07A 1
15
VCC5
FP_PD
U11
2
16
7
R232
SN74LVC07A
18
C POWER LED
KEY
PWRLED 19
220 16
KEY
17 GND
20
KEYLOCK#
KEY
21
KEYLOCK
22 23 24
AC97SPKR SPKR_IN
JP22 VCC3_3
Q11
1
14
ICH_SPKR
SPEAKER
R_SPKRIN
VCC5
26
C
FNT_PNL_CONN
R234
2 3
R235
SPKR
3 SPKR_Q1G B
8
7
6
5
RP62
2.2K
SP1
68
1 2 E
4.7K
KEY
25
R233 68
2N3904
26
C373
C378
1
C258 SPKR_NEG
0.1UF
470PF
+
2
POS NEG
470PF
Speaker Circuit
FAN Headers 1
2
3
4
B
B
VCC3SBY
VCC12
VCC12
VCC3SBY
TACH1
TACH2
16
14
R98
330
VCC
3
U5
VCC 4
1
6
2
GP23LED
GP26LED
GND
GPIO26_FPLED 14
5 7
On-Board LED indicates the Standby Well is on to prevent Hot-Swapping Memory.
GND
SN74LVC07A
SN74LVC07A
CR3
VCC12 1
VCC12
330
GPIO23_FPLED
4.7K
3
14
R172
3
U5 R188 2 V3SBLED
2
14
1
2
7
16
VCC3SBY
0.1UF
J24
0.1UF 1
CR12
J26
330
VCC3SBY C363
R97
VCC3SBY C23
A
A C362 J27
C365 J25
0.1UF
0.1UF
1
1
2
2
3
3
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
SYSTEM, PART 1 DRAWN BY:
16
PWM1
8
PWM2
16
R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:44 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
31
OF
40
8
7
6
5
4
3
2
1
SYSTEM ITP RESET CIRCUIT - FOR DEBUG ONLY
Power Connector and Reset Control
VCC3SBY
VCC3SBY
R99
D
D
240
Power Good Circuit
DBRESET#
4
U10
14
1
3
VCC5SBY
VCC5
APOK_ST
VCC5SBY
VCC_5-
VCC2_5
DBRST
7 SN74LVC08A
VCC12
VCC12-
2
U12
14
1
VCC3_3
U12
2
14
3
ST23
7
74LVC14A
VCC3SBY
4 7
74LVC14A
R10
R90
SN74LVC06A has 5V input tolerance
330
0K VCC5SBY VCC3SBY
11 12
U3
SLP_S3#
14
13 VCC
5
6
14
5VPSON
15
7 GND SN74LVC06A
16
SN74LVC06A is 5V output tolerance
C
VCC
1
PWRGOOD
2
4
7 GND
4.7K
14,32
14
74LVC14A is 5V input tolerant
J4
R62
U3
17 18 19 20
3_3V1
3_3V11
3_3V2
-12V
GND3
GND13 PS_0N
5V4
ATX
GND5
GND15 GND16
5V6
GND17
GND7 PW_OK
-5V 5V19
5VSB
5V20
12V
1
DBRPOK
SN74LVC06A
32
2 3
R91
4
0K
6
VCC3SBY
U4
R92
74LS132 4 DBRPOK_DLY
ATX_PWOK 5
14
VCC 6
PWROK#
5
0K
7
VCC3SBY GND
C
7
R200
C183
8
Do Not Stuff C183
9
4.7K 1.0UF
U3
14
10
VCC
3
4
PWROK
14,28,29
7 GND SN74LVC06A
R199
Do Not Stuff For Debug Only
1M
220 Ohm Pull-up to 3.3V is on VRM Sheet
VRM_PWRGD
30
Reset Button SW1 1
2
B
R24
B
3
4
RST_PD
PBSWITCH
22 C185
Resume Reset Circuitry
10UF
Schmitt Trigger Logic using a 22msec delay
1
0.01UF
Place JP23 Near Front Header (J20)
2
+
C45 JP23
VCC3SBY
VCC3SBY
VCC3SBY
CLOCK POWERDOWN CONTROL
22K
U12 V3RSMRST
14,29,32
6 7
74LVC14A
R86 8.2K
SLP_S3#
U12
14
5
R142
ST69
14
9
8
C264
VCC3SBY
R196
14,28
Do Not Stuff For Debug Only
1M
1.0UF
A
RSMRST#
7
74LVC14A
A 32
DBRPOK
14
4
U10 6
5 7 SN74LVC08A
R84
CK_PWRDN#
CK_PWRD
6
0K Do Not Stuff R84 - For Test Only: If R84 is Populated, R86 Must Be De-Populated
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
SYSTEM, PART 2 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
12-6-1998_12:54
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
32
OF
40
7
6
5
4
3
PULL-UP RESISTORS AND UNUSED GATES PCI BUS 18
D
13,17,18,27 13,17,18 13,17,18,27 13,17,18,27 13,17,18,27 13,17,18,27 13,17,18,27
U 4,33
VCC5
PERR#_PU
2
SERR#
3
17
PLOCK#
4
17
STOP#
5
DEVSEL#
6
TRDY#
7
IRDY#
8
FRAME#
9
VCC3SBY
RP47
17 2.7K
1
1
ICH0
VCC5
RP59
2
17
SDONEP1
1
8
SDONEP2
2
7
SBOP1
3
6
SBOP2
4
5
D RP61 14 14
5.6K
14 VCC5
14
SMBALERT#
1
8
LDRQ#1
2
7
GPIO12
3
6
GPIO13
4
5
R73
APICD0
4,13
150 R6
APICD1
4,13
4.7K
150
10
RP60
RP58 9 PULLUP/DOWN RESISTOR PAK
18 18
RP45 PIRQ#D
13,17,18
PIRQ#C
13,17,18 13,17,18 13,17,18,27 13,27 13,18 13,17
C
13,17
VCC5
2
17,18 17,18
3 4
PIRQ#A
5
PREQ#3
6
PREQ#2
7
PREQ#1
8
17
PREQ#0
9
17
2.7K
13,27
2
7
3
6
PTMS
4
5
11,12,14,25,28 14
1
8
2
7
SMBCLK
3
6
INTRUDER#
4
4,13
17
8
PGNT#1
2
7
PGNT#2
3
6
4
NMI
1
8
USLP#
2
7
STPCLK#
3
6
SMI#
4
5
150
1
VCC3_3
17
RP56
PU1_ACK64#
1
8
PU1_REQ64#
2
7
PU2_ACK64#
3
6
PU2_REQ64#
4
5
REQ#B/GPIO1
13 13 13,16,18
1
8
2
7
GNT#B/GPIO17
3
6
SERIRQ
4
5
PU3_ACK64#
18
PU3_REQ64#
18
4,13
INTR
1
8
INIT#
2
7
IGNNE#
3
6
A20M#
4
5
8.2K
C
150
RP52
R208 2.7K
RP49 4,13 4,13,15 4,13
2.7K
13,18 14
R207
13,16
2.7K
13,16
5
PCI_REQ#A
1
8
THERM#
2
7
RCIN#
3
6
A20GATE
4
5
R169
FERR#
4,13
150
8.2K RP53 14,16 14,18
LPC_SMI#
1
8
GPIO7
2
7
3
6
4
5
VCC3SBY
UNUSED GATES
14
9
U10
14,16
8
14,18
10
14
11
4
R68
RTTCTRL
110, 1%
RP54
VCC3SBY U12
For Future Compatibility Upgrade
8.2K
VCC3SBY 14
VCC3_3
4,13 4,13 VCC3_3
8.2K
B
RP50
5
4.7K
RP51
PGNT#0
PGNT#3
SBOP3 PTDI
SMBDATA
11,12,14,25,28
1
RP57
13,18
8
4,13
9 PULLUP/DOWN RESISTOR PAK
13,17
1
VCC5
10
13,17
SDONEP3
5.6K
PIRQ#B
VCMOS
8
1
8
GPIO22
2
7
LPC_PME#
3
6
GPIO21
4
R70
SLEWCTRL
110, 1%
B
5
8.2K
7 SN74LVC08A
10
4
VCC5
7
74LVC14A
U5
14
VCC
9
8
VCC 14
U11
9
GND
SN74LVC07A
14
11
10
11 7
7
U3
13
12
74LS132 9 14
7
7 GND SN74LVC07A
5
AC_SDIN1
14,26
VCC
R166 10K
R170 10K
8
VCC
11
14
10
10 7
7 GND
A
4
AC_SDIN0
14,26
VCC 14
14
12
6
IRQ15
8.2K
U4
U5
3
10
SN74LVC07A
VCC
7
IRQ14
VCC5SBY
GND
SN74LVC07A
13
13,19 13,19
VCC3SBY
VCC
GND
U11
7 SN74LVC08A
74LVC14A
U5
VCC
8
2
13
12 7
SN74LVC07A
14
U11
RP55 1
11
14
13
7
7 GND
U12
U10
14
12 8
GND
SN74LVC06A
A
GND SN74LVC07A
U4 U3
14
74LS132 12
VCC
13
12 7 GND
14
11 13 7
SN74LVC06A
VCC
GND
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
PULLUP/PULLDOWN RESISTORS DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
33
OF
40
8
7
6
5
4
3
2
1
370-pin Socket Decoupling VCCVID Decoupling D
Place in 370 PGA Socket Cavity
D
VCCVID Bulk Decoupling 1206 Packages
C125
C152
C136
C117
C110
C115
C153
C146
C126
C139
C155
C140
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
4.7UF
VCCVID High Frequency Decoupling 0805 Package
C
C C121
1.0UF
C142
1.0UF
C118
C113
1.0UF
1.0UF
C120
1.0UF
C149
1.0UF
C145
C107
1.0UF
1.0UF
C154
1.0UF
C156
1.0UF
C148
C135
1.0UF
1.0UF
C132
1.0UF
C137
1.0UF
C138
C151
1.0UF
1.0UF
C108
C141
1.0UF
1.0UF
C143
1.0UF
C134
1.0UF
VTT Decoupling 0603 Package placed within 200mils of VTT Termination R-packs One Capacitor for every 2 R-Packs
B
B
C384
2
+
1
VTT1_5
22UF
C33
0.1UF
C34
C129
0.1UF
0.1UF
C11
0.1UF
C32
0.1UF
C133
C144
0.1UF
0.1UF
C150
0.1UF
C157
0.1UF
C218
C220
0.1UF
0.1UF
C219
0.1UF
C205
0.1UF
C221
C42
0.1UF
0.1UF
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
VRM DECOUPLING DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
12-8-1998_14:04
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
34
OF
40
8
7
6
5
4
3
2
1
DRAM, CHIPSET, and BULK POWER DECOUPLING GMCH Decoupling
Display Cache Decoupling
ICH0 Decoupling Distribute near the 1.8V power pins of the ICH0.
D VCC3_3
VCC1_8
ICH0 3.3V Plane Decoupling: Place 1 .1uF/.01uF pair in each corner, and 2 on opposite sides close to component if they fit.
VCC3_3 Distribute near the power pins of both SDRAM components.
VCC1_8
VCC3SBY
1 C215
C381
C163 0.1UF
C286
10UF
10UF
C244
0.1UF
C372
1
C273
+
0.1UF
+
0.1UF
0.1UF
C243 0.1UF
C247 0.1UF
C232 0.1UF
C251 0.1UF
C252 0.1UF
C223 0.1UF
C249
C319
0.1UF
0.1UF
C307 0.1UF
C295 0.1UF
C296 0.1UF
C10 0.1UF
C345
C308
C332
0.1UF
0.01UF
0.01UF
C304 0.01UF
C305
C41
0.01UF
0.01UF
C289
C263
0.01UF
0.1UF
C171
C303 0.1UF
C67
+
C382
0.1UF
1
C239
0.1UF
1
+
C44
C130
0.1UF
0.1UF
2
2
2
2
10UF
D
Distribute near the VCCSUS power pins of the ICH0.
2.2UF
GMCH Core Plane Decoupling: Place 1 .1uF/.01uF pair in each corner, and 2 on opposite sides close to component if they fit.
VCC1_8
C
C C131 0.01UF
C164
C242
0.01UF
C237
0.01UF
C214
0.01UF
C380
C233
0.01UF
0.01UF
C383
0.01UF
0.01UF
Bulk Power Decoupling
System Memory Decoupling
VCC5
VCC3_3
VCC12
VCC_5-
VCC12-
+
C162
C234
C341
C343
C350
C278
C260 0.1UF
C288
C245 0.1UF
C248 0.1UF
C254 0.1UF
C181
22UF
C72
C66
C360
C69
C333
C367
0.1UF
0.1UF
C321
22UF
2
C62
0.1UF
0.1UF
0.1UF
0.1UF
C81 0.1UF
+
1 0.1UF
+
22UF
2
C87
2
0.1UF
22UF 1
22UF
C86
1
2
1
22UF
0.1UF
+
C83
0.1UF
C70 +
C82
2
C85 +
1
DIMM0 Decoupling: Distribute near DIMM0 Power Pins.
GMCH 3.3V IO Decoupling: Place near GMCH Display Cache Quadrant
1
VCC3SBY VCC3_3
C80
C324
C317
0.1UF
0.1UF
0.1UF
C84
C175
0.1UF
0.1UF
2
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
3 VOLT Decoupling B VCC3SBY
DIMM1 Decoupling: Distribute near DIMM1 Power Pins.
Distribute as close as possible to GMCH System Memory Quadrant
+
C188
C169
C262
C352
1
22UF C170
C377
C77
0.01UF
0.01UF
0.1UF
C283
C298
C291
C354
C285
C339
C160
C250
C78
C340
C318
C172
C376
C320
C240
C256
C127
C338
C322
C73 0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
0.1UF
2
0.01UF
C253
0.1UF 0.1UF
0.01UF
B
VCC3_3
VCC3SBY
A
A
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
DRAM, ICH, AND GMCH DECOUPLING DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09
1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
35
OF
40
8
7
6
5
4
3
2
1
Revision History (Changes from Rev 0.7) She e t De s cription A LL Cosmetic changes to all pages (Re-names nets, re-organized symbol arrangement, etc.) 4
Changed FB1 (f errite bead f or PLL analog isolation) to Inductor L2.
11 12
Changed value of R36 to 10 ohms. D
She e t De s cription 10 Ganged the tw o CKEs of f of one 4.7K Pull-Up to 3.3V . Fixed Symbol Pinout
Replaced R21-R23 w ith 1K R-pack (RP50). Replaced R24-26 and R34 w ith RP44.
Fixed Symbol Pinout Removed SMBUS pullups f rom this page. There are pullups on page 32.
Changed R184 value to 220 ohms
Removed Reset Straps f rom MD lines.
Changed Pull-Up/Dow n Resistor V alues on signals to ITP interf ace and grouped into Rpacks/Discretes to make true populate/de-populate Mf g. Option. Floated THERMTRIP# Signal
13
Updated Ballout Changed C172 to 0.1UF Cap (HUBREF decoupling) A dded Resistor Site to Pull F16 to GND f or test/debug.
Generate GTLREF w ith 1% resistors. Move f rom page 5 to page 4. Changed BR0# Pull-Dow n to 56Ohm to use existing GTL Term Rpack Slot on sheet 5
D
14
A dded Jumper Test Option to GND BSEL line. Change R35 f rom 51Ohm, 1% to 51Ohm, 5%
Updated Ballout Routed PME# and SMI# to GPIO[13:12] respectively to w ake events f rom S1. Pull RTCRST# signal f rom input node of f irst RC delay rather than output node (just other side of diode). Moved Clear CMOS to RTCRST# signal and A dded 1K resistor to GND on pin 3 of jumper.
A dded V CMOS Decoupling C
C
6
Changed V DDA (pin22) of CK-Whitney to 3.3V Supply pet 0.5 Spec.
Change RTC Circuit to pow er V bias straight f rom positive terminal of battery (BA T1). Was charged f rom V CCRTC input. Changed A C_SY NC pull-dow n strap (U Saf e Mode Jumper JP14) to A C_SDOUT pullup strap. Change C8 and C9 to 12pF caps.
A dded/Modif ied Decoupling and Pow er Isolation Ganged U and GMCH Clock Lines Isolated USB/DotCLK pow er (pin 27) f rom SDRA M pow er
Tied OC#0 and OC#1 together.
Changed Pow erDow n control signal to NA ND of SLP_S3# and PWR_OK
A dd jumper straps to SPKR and A C_SY NC
Change C146 and C147 f rom 10pF to 12pF
B
Remove Pull-up f rom SLP_S3# signal
7
Updated GMCH BallOut
8
Changed GTLREF divider to 1% resistors and GTLREF Decoupling to a 0.1uF (C2) and 0.001UF (C72) in parallel Updated GMCH BallOut
15
HUBREF Generated f rom tw o 1% resistors w ith 0.1uF (C171) at GMCH HUBREF pin.
Changed JP4 to a 2 pole instead of 3 pole jumper.
Changed C3 to 20pF Cap
Replace discrete resistors w ith R-packs. Replaced R84-87 w ith RP42.
Decoupled System Memory 3.3V balls f rom Local Memory 3.3V balls. System Memory quadrant connects to 3.3V sb plane and Local Memory connects to 3.3V plane. Updated GMCH BallOut
9
Connected V CCDA CA and V CCDA signals to 1.8V through f iltering circuitry. Connected V SSDA CA and V SSDA to Digital GND. A dded Reset Strap jumpers to LMD[31:26].
A
Updated FWH pinout and labelled symbol as a TSOP Socket. Updated FWH (Socket) Symbol to include FGPI[4:0], routed A TA 66 cable detect to GPI[1:0] and pulled rest dow n through 8.2K. Cominbed Decoupling Caps and reduced to appropriate amount.
16
B
Updated Pinout. Connected new V REF pin to 5V . A dded Decoupling to IRRX/IRTX lines. Routed PME# and SMI# to GPIO[13:12] respectively to w ake events f rom S1. Routed Game Port to game port header, 2nd Serial Port to serial header, PWM/Tach signals to f an headers, and unused signals to test header. Routed Unused GPIOs signals to test header.
Added Oscillator to DotCLK for Test/Debug option
Removed JP6 and Grounded CLOCKI.
Connected Digital V ideo Out signals
Connected V TR to V CC3.3 (removed f rom V CC3SB w ell) and added pow er decoupling. Pulled SY SOPT pin dow n to GND through 4.7K resistor. Moved Keylock pull-up sheet 31.
Changed R70 to 33Ohm and C4 to 20pF.
REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
REVISION HISTORY, PART 1 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
A
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:43 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
36
OF
40
8
7
6
5
4
3
2
1
Revision History (Changes from Rev 0.7)
D
Sheet Description 17 C hanged device num ers (ID SEL w iring) for s lots to AD 16, AD 17, and AD 22. R outed additional s ignals required to AD 22 s lot to s upport ISA bridge tes t card. 18 C hanged device num ers (ID SEL w iring) for s lots to AD 16, AD 17, and AD 22. R outed additional s ignals through 0K res is tors to AD 22 s lot to s upport ISA bridge tes t card. Added Jum per to route PER R # to IC H /IC H 0 if IC H is populated. 19 C onnected pin 34 of each connector to P66D ETEC T and S66D ETEC T(FWH _GPI0 and FWH _GPI1 res pectively). Buffered PC IR ST# s ignal going to pin 1 of ID E connectors to is olate cable loading. R em oved Series Term inations from IR Q lines (pulled into IC H 0). 20
Sheet 27 C hanged 93C 46 Pinout. 28
29
Is olated each VC C input to U SB s tacked connector through dedicated filtering circuitry. Added 47pF EMI caps on U SB data lines . C onnect U SB through Audio/Modem R is er through 0K res is tors . Make OC detect circuitry unique to each port and update polyfus e value.
22
23 B
25
26
R eplaced D B25 connector w ith 2x13 header s o w e can cable out. SMB R em oved Series Term ination R es is tors from Ack# and Bus y# s ignals .
30
C hanged Pull-ups to 2.2K Added 2nd s erial port and connected both through 2x5 headers to cable out (R em oved 1 D B9 C onnector). Added dis crete s olution to level trans late and route R ing Indicate from Serial ports to IC H for Wake from S3 on s erial m odem . Added MID I/Gam e Port circuitry connected through 2x8 header to cable out. Increas ed C ap values on Keybd/Mous e lines from 100pF to 470pF. C hanged the keyboard and m ous e s ym bols to a PS/2 s tacked connector. C hanged R GB PI filter caps from 22pF to 3.3pF. Added Quick Sw itch to level trans late the C R T Sync, C R T D D C , and Flat D D C Signals .
31
32 32 33
Is olated C K-Whitney from SMBU S in Pow er D ow n through Voltage trans lation Quick Sw itch. C hanged VGA C onnector s ym bol. Added EMI C aps on SYN C and D D C Signals . R outed U SB up the AMR C onnector.
A
R an 5V (ins tead of 5VSB) to Audio Modem R is er. Added s tuffing option AC ’97 debug port
R eplaced R J45 connector and dis crete m agnetics w ith integrated R J45/m agnetics part and connected accordingly.
34 35
Moved Pow er C onnector to Sheet 32 R eplaced old VC C 5dual circuit, w ith VC C 3Sby C ircuit w hich generates s upply for devices w hich m us t s tay pow ered in S3. R em oved LT1585-3.3 (U 36 on rev0.7). C hanged U 27 from LT1585-1.5 to LT1587-1.5 and changed dis cretes . Added V3SB regulator (generated V3SB from V5SB from ATX pow er s upply). C hanged 1.8V R egulator des ign from LT1585AD J to LT1587AD J and change d dis cretes . C hanged 2.5V R egulator des ign from LT1585AD J to LT1587AD J and changed dis cretes . Added VR M Override Jum pers to VID bus . C hange VR D es ign to VR M8.4 com pliant des ign. U s e LTC 1753 per Linear App N ote. Moved R es et and Pow er circuitry to s heet 32 Added Infrared, Pow er Sw itch, H ard D rive/Pow er LED s , Keylock, and Speaker C ircuitry to C om m on Sys tem H eader. Added 12V Fan H eaders (2 s upporting TAC H outputs , and 2 s upport PWM inputs ).
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
5
4
3
FOLSOM, CALIFORNIA 95630 2
A
REV:
1.3
DRAWN BY: R
6
B
C om bined like pullups into R -packs w here pos s ible. Added 8.2K pull-ups to SER IR Q and IC H 0 unus ed GPIOs . Added Pull-U p Sites for FLU SH # and 370PGA Socket Pin W35 to VC MOS for future com patibility upgrade. U pdated Proces s or D ecoupling per lates t Guidelines for 370PGA s ocket. Added Sys tem D ecoupling
REVISION HISTORY, PART 2
7
C
Added D ebug LED to m onitor 3.3VSBY Plane Moved Pull-ups to s heet 33. U pdated new PWR OK/PWR GOOD Generation, R ESET, R SMR ST# circtuitry. Pulled-U p SMBU S interface to 3.3VSby ins tead of 3.3V. R em oved R 164 (FLU SH #) and R 168 (TH ER MTR IP#) pull-ups . R em oved pull-up on PWR GOOD (pulled up on s heet 32). Grouped rem aining pull-ups to 1 1K R pack. C hanged all PC I 3.3V pull-ups to 8.2K per PC I s pec.
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
8
D
Added LAN D is able Jum per. Added IC H /IC H 0 s calability jum pers .
C
21
Description
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:43 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
37
OF
40
8
7
6
5
4
3
2
1
Revision History (Changes from Rev0.9 to Rev0.95) De s c r ip t io n Sh e e t 2 Ch a n g e d "V id e o En c o d e r " b o x o n B lo c k Dia g r a m to " Dig ita l V id e o O u t De v ic e " B o x . 3 4
A d d e d De v ic e Ta b le
22
Ch a n g e R2 0 7 f r o m 4 7 K to 1 0 K
Ch a n g e d Re f e r e n c e De s ig n a to r o n 3 7 0 - p in S o c ke t f r o m J2 0 to X 1
23
Mo v e d RP3 1 f r o m p g . 1 6 to p u ll- u p Ke y /Mo u s e lin e s to f ilte r e d V CC5 .
Ch a n g e d Re f e r e n c e De s ig n a to r o n 3 7 0 - p in S o c ke t f r o m J2 0 to X 1
A d d e d 4 7 0 p F Ca p s o n MIDI lin e s ( C3 2 7 ,C3 2 8 ) .
Ch a n g e d C1 f r o m 2 2 u F,3 0 % to 4 7 u F,1 0 %
D
6
8 9
De s c r ip t io n Sh e e t 20 Ch a n g e d R1 1 7 ,R1 1 8 ,R1 2 1 ,R1 2 2 f r o m 2 7 o h m to 1 5 o h m- 1 % Re s is to r s
25
Cle a n e d Up V G A Co n n e c to r S c h e ma tic
Ch a n g e d S e r ie s Te r min a tio n Re s is to r V a lu e s f r o m 2 2 O h ms to : R3 7 ,R3 8 ,R5 5 ,R5 6 ,R5 7 =4 3 o h m,2 % ; R3 9 ,R4 0 ,R4 1 ,R4 2 ,R4 3 ,R4 6 ,R4 7 ,R5 8 ,R5 9 ,R6 0 ,R6 1 =3 3 o h m,2 % ; R4 5 ,R4 8 ,R4 9 ,R5 0 ,R5 1 ,R5 2 ,R5 3 ,R5 4 ,R6 3 =3 3 o h m,5 % ; R4 4 ,R2 2 6 =1 0 o h m,5 % T’e d REFCL K a n d a d d e d R2 2 6 ( to s e p a r a te te r min a tio n to ICH a n d S IO) . Re n a me d CL K 1 4 to S IO_ CL K 1 4 a n d ICH_ CL K 1 4 f o r e a c h n e w NET o u t o f th e T. Ch a n g e d C1 4 4 a n d C1 8 5 f r o m 4 .7 u F to 2 2 u F.
A d d e d Pr o v is io n s to a d d PI Filte r s o n V S Y NC a n d HSY NC L in e s Ch a n g e d 5 V S u p p ly to Q u ic k S w itc h to p u ll- d o w n o n DIO DE o u tp u t. A ls o p u lle d DDC lin e s u p to th e s a me s u p p ly p o w e r in g th e Qu ic k S w itc h . Ch a n g e R1 3 2 ,R1 3 3 f r o m 8 .2 K to 1 K Pu ll- Up s
A d d e d Ca p S ite to G MCH Hu b Clk A d d e d 0 K Re s is to r ( R2 3 1 ) in s e r ie s w ith DCL K _ W R
26
Re mo v e d A C9 7 De b u g Co n n e c to r ( J5 )
Ch a n g e d Re f e r e n c e De s ig n a to r o n O s c illa to r S o c ke t f r o m U3 4 to X 2
27
Ch a n g e d R4 p u ll- u p f r o m 6 2 K to 4 .7 K a n d a d d e d 0 .1 u F De c o u p lin g to V IO p in ( C2 6 2 ) .
Up d a te d Pin Nu mb e r s to ma tc h G MCH 0 .7 EDS B a llo u t
28
Ch a n g e R1 4 0 /R1 4 1 to 4 .7 K Re s is to r s
A d d e d 0 K Re s is to r ( R2 3 2 ) in s e r ie s w ith L RCL K
29
Mo d if ie d CK _ PW RDW N# G e n e r a tio n Cir c u itr y to p u ll o f f U3 3 NA ND g a te a n d in v e r t th r o u g h U1 3 to g e t c o r r e c t lo g ic le v e l. Pr e v io u s ly it w a s ta p p e d o f f th e b a s e o f B JT Q 6 . Th is w o u ld h a v e ke p t CK _ PW RDW N# f r o m c h a r g in g h ig h e r th a n 0 .7 V ( d r o p a c r o s s B E ju n c tio Ch a n g e d R1 9 1 to 1 0 K , R1 9 2 to 0 K , a n d R1 9 3 to 4 .7 K
Co r r e c te d Co n n e c tio n o f De b u g O s c illa to r f r o m DDCS DA to DOTCL K NET. C
A d d e d De c o u p lin g f o r L A N Po w e r ( C3 3 6 - C3 4 1 )
A d d e d Ca p S ite to ICH Hu b Clk Re p la c e Be a d FB 2 1 w ith In d u c to r ( L 4 ) - 6 8 n H to c r e a te L C f ilte r ( <1 3 0 kHz )
14
30
Ch a n g e d Re f e r e n c e De s ig n a to r o n U8 to V R5 , U1 1 to V R3 , a n d U2 7 to V R4
Ch a n g e d Te s t O s c illa to r Cir c u it ( U3 4 ) to r e mo v e s h o r te d ju mp e r a n d a d d d e c o u p lin g . Ch a n g e d p in n a me s o n 4 8 MHz o s c illa to r s y mb o l. Mo v e d R6 7 ,R6 8 ,R6 9 to S h e e t 2 5 .
Ch a n g e d C2 6 8 a n d C2 5 9 to 1 .0 u F,X 7 R c a p s A d d e d 2 mo r e S i4 4 1 0 DY FETs in p a r a lle l w ith tw o th e r e ( Q 7 /Q 8 )
Re n a me NET CL K 1 4 to ICH_ CL K 1 4
Ch a n g e d C1 6 0 - C1 6 3 to 2 7 0 0 u F a n d a d d e d o n e mo r e ( C3 4 2 ) in p a r a lle l.
Re n a me Pin L 1 to V CCSUS 1 a n d Pin N1 to V CCS US2
Ch a n g e C1 5 3 to 2 2 0 p F
Re n a me NET G PIO 2 3 to G PIO 2 3 _ FPL ED, a n d NET G PIO2 6 to G PIO 2 6 _ FPL ED
Ch a n g e d c o n n e c tio n s o f COMP a n d S S to s h o w th e m r e tu r n in g d ir e c tly to S G ND p in .
Ch a n g e d V a lu e o f C1 1 f r o m 0 .1 u F to 1 .0 u F Ch a n g e d Re f e r e n c e De s ig n a to r o n U9 to X 3
15
A d d e d 0 K RPA CK ( RP6 8 ) in s e r ie s to G ROUND o n FW H ID lin e s f o r Te s t/De b u g .
16
Ch a n g e d Pin 8 7 Na me f r o m RTS 1 # _ S Y S OP to RTS 1 # a n d Pin 5 0 n a me f r o m G P2 7 /IO _ S MI# /TES T to S P2 7 /IO_ S MI# Re n a me NET CL K 1 4 to S IO _ CL K 1 4
16
A d d e d In d u c to r ( L 1 3 ) to f ilte r 5 V in p u t to V RM 31
15
B
Ch a n g e r e f e r e n c e d e s ig n a to r S 1 to S W 1 Ch a n g e C7 9 to 1 .0 u F A d d Fr o n t Pa n e l Du a l L ED Cir c u it c o n tr o lle d b y ICH G PIO s
32
Ch a n g e A TX c o n n e c to r Re f e r e n c e De s ig n a to r f r o m U6 to J2 9 . Ch a n g e r e f e r e n c e d e s ig n a to r S 2 to S W 2
33
Re mo v e d Pu ll- Up s f r o m GPIO 2 3 /GPIO 2 6
16
Mo v e d RP3 1 to p g . 2 3 to p u ll- u p K e y /Mo u s e lin e s to f ilte r e d V CC5 .
Pu lle d L DRQ # 1 Up to 3 .3 V S b y ( in s te a d o f 3 .3 V ) .
17
S w a p p e d A CK 6 4 # a n d REQ6 4 # to r o u te to c o r r e c t p in s p e r PCI s p e c .
Ch a n g e d PCI Pu ll- Up Re s is to r ( R9 9 ,R1 0 0 ,RP5 3 ,RP4 6 ,RP4 7 ) v a lu e s f r o m 8 .2 K to 2 .7 K a n d c o n n e c te d to 5 V . A ls o c o n n e c te d RP4 0 a n d RP4 3 to 5 V ( f r o m 3 .3 V ) to ma in ta in c o mp a tib ility w ith mo r e 5 V PCI c a r d s . Re mo v e d RP4 9 ( V ID Pu ll- Up s ) S in c e in te r n a l to L TC1 7 5 3
18
S w a p p e d A CK 6 4 # a n d REQ6 4 # to r o u te to c o r r e c t p in s p e r PCI s p e c . Re p la c e d JP6 Ju mp e r w ith 0 K Re s is to r S tu f f in g O p tio n ( R2 3 3 , R2 3 4 )
A
19
In s e r te d 0 K S tu f f in g Re s is to r s in S e r ie s w ith A TA 6 6 Ca b le De te c t ( R2 3 5 ,R2 3 6 )
19
S w a p p e d 7 4 L S 0 7 o u t f o r 7 4 L V C0 7 A a n d c o n n e c te d to 3 .3 V .
35
A d d e d a d d itio n a l De c o u p lin g f o r V a r io u s Co mp o n e n ts ( C3 4 3 - C3 8 9 ) A
Ch a n g e d C2 1 7 - C2 2 0 f r o m 0 .1 u F to 0 .0 1 u F A LL
Ch a n g e d Re f e r e n c e De s ig n a to r s o n A ll Fe r r ite B e a d s f r o m FB * to L *. REV:
TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
REVISION HISTORY, PART 3 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
8
7
C
Ch a n g e d Re f e r e n c e De s ig n a to r o n U1 5 a n d U2 5 to Q9 a n d Q 1 0 r e s p e c tiv e ly .
A d d e d L C f ilte r to 1 .8 V p la n e c o n n e c te d to b a lls U6 a n d E1 9 .
Ro u te d L PC_ SMI# a n d L PC_ PME# to G PIO [5 :6 ] r e s p e c tiv e ly f r o m G PIO[1 2 :1 3 ] r e s p e c tiv e ly . B
D
Mo v e d R6 7 ,R6 8 ,R6 9 f r o m S h e e t 9 .
6
5
4
3
FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:43 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
38
OF
40
8
7
6
5
4
3
2
1
Revision History (Changes from Rev0.95 to Rev0.99) S he e t De scrip tio n 4 Changed C1 to 33uF and L2 to 4.7uH.
D
5 6
7 8 C
9
S he e t De scrip tio n Change C330 to a 100pF c ap and S c aled B ac k Dec oupling on power planes 24 to U28.. Connec ted E 21 to V CC_DE T P ull-Up S wapped Connec tivity of F TCLK 0 and F TCLK 1. A dded 0603 Cap S ite on UHCLK 25 F ix ed Connec tivity of CR2, CR4, CR5, CR6 and CR7. In all c as es P ins 1 and 2 were s wapped. Rem oved RP 50 and routed TCK and TM S to 330ohm pull-ups in RP 44. Change L8,L9,L10 P art Num ber to B LM 11B 750S Changed Rpac k c onnec tions per Lay out B ac k A nnotation Changed F 3 from 2.0A F us e to 2.5A F us e. Changed R39-R43,R46,R47,R58-R61 to 33ohm , 5% (from 2% ) 27 Rem oved P ull-up from LA NTCK (U29.D14) and m ade No Connec t. R136 m oved to S heet 16 to P ull-up LP D (U16.27). Routed CK _P W RDN# to Cloc k Chip (S LP _S 3# thru 8.2K res is tor by default). Rem oved C338,C339,C340,C341 and Changed C336,C337 to 4.7uF P olariz ed Capac itors . A dded 0603 Cap S ite on G M CHHCLK Changed INTA # (U29.H2) from P IRQ #D to P IRQ #A and Changed LA N IDS E L (R142.1) from A D19 to A D20. Changed HUB RE F V oltage Divider Res is tor V alues (R182 and R185) from 1K 28 M ade C74 a 470pF -1500V c ap and added "F or E S T Tes ting" Note. 1% to 301ohm -1% and added A C Dec ouping Dis c rete S ites (C394,C395,R245, R246) A dded 22ohm s eries term (R242) to LTCLK Net (U22.K 22). Changed J28.14 c onnec tion from A CTLE D to S P E E DLE D and Changed R219.1 c onnec tion from V CC3S B Y to A CTLE D M oved C323, C324 to page 34 and m ade C324 0.01uF . A dded P rovis ion for Is olating 82559 either on S US _S TA T# or P W RO K Rem oved L5 and C325. Change C5 to 33uF . Connec t U22.U6 and U22.E 19 29 Changed Referenc e Des ignator U14 to Q 10 and U16 to Q 11. direc t to V CC1_8 P lane. Change U22.A B 21 and U22.A B 23 to c onnec t to V CC1_8. Rem oved S eries Term s on Digital V ideo O ut P ort Renam ed NE T CK _P W RD to IN_U5, and Deleted c onnec tion to U13 pin 9 A dded 0K (R31) in s eries with Debug O s c illator Rem oved CK _P W RDW N# NE T, R240 Routed DC_M D27 (c ore detec t S trap) to 10K to 220 pull-up on V CCDE T net.
14 B
16 19
20
A
22
Changed C148 from 2.2uF M onolithic to 2.2uF P olariz ed Changed Referenc e Des ignator on B A T1 to X4 (it is a s oc k et footprint ). P ulled Up S US S TA T to 3.3V through 4.7K (R136, whic h was rem oved from LA N page) res is tor and dis c onnec ted from ICH0. Changes to P 66DE TE CT and S 66DE TE CT NE Ts to s upport both Drive and Hos t S ided 80 c onduc tor c able detec tion: A dded C392 and C393 (0.047uF , X7R, 16V , 10% ) to G ND, 0ohm Res is tors in S eries (R235,R236), and 15K P ulldowns (R243,R244) to G ND. F ix ed Connec t ivity of Res is tor R124. US B V 5 Net now Connec t s direc tly to L26 term inal 1, and R124 dis c onnec ted from L26 t erm inal 1. E lim inated unwanted res is tor divider on 5V power pins at US B port. A dded S eries Res is tors (0K ) to dec ouple ICH US B s ignals from s tac k ed c onnec tor if rout ed up A M R c onnec tor. Changed Net Nam e G _ICHRI# to ICHRI#_C
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Connec ted Q 4.{5-8}/Q 7.{5-8}, C193, R150 to Net 5V IN ins tead of direc t to V CC5. A dded 0K Rpac k (RP 69) in S eries to V ID[3:0] pins of V R3. Changed S wit c h S y m bol to 4-pin devic e to m atc h phy s ic al devic e. Changed RefDes U6 to J29.
B
A dded provis ion for s ending early powerok to Cloc k P D# pin for c lean P owerup 33
S wapped S IP Rpac k s on U and ICH pull-ups to 4-E lem ent Rpac k s per Lay out B ac k A nnot ation Change RP 48 from 1K Rpac k to 330ohm Rpac k , and R202, and R203 from 1K res is tors to 330ohm res is t ors for future upgrade c om patibility . A dded A ddit ional Dec oupling on V CC12- and V CC12 1.3
REVISION HISTORY, PART 4 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
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FOLSOM, CALIFORNIA 95630 2
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TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
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Changed S wit c h S y m bol to 4-pin devic e to m atc h phy s ic al devic e.
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INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
11-23-1998_13:43 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
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Revision History:Changes from Rev0.99 and On Changes from Rev0.99 to Rev1.0 D
D
- Back Annotated from Layout (Reference Designator Changes/Rpack Routing Swaps) - Changed Series Term Values on U and APIC Clocks to 33ohm (Sheet 6) - Changed Series Term Values on Memory, Hub, and DOT Clocks to 22ohm (Sheet 6) - Added 10K Pull-Ups on SLP_S3# and SLP_S5# (Sheet 14) - Added 2 1200uF Caps on VCC3_3SBY Plane (Sheet 29)
Changes from Rev1.0 to Rev1.1
C
- Removed X1, R77, R78, R79 (Debug Oscillator Socket) from Sheet 9 - Connected C377 to VCC3_3SBY Plane - Corrected Pinout of 2x5 Com Port Headers (Sheet 22) - Added 2x1 Header (JP23) to sheet 32 for Chasses Reset Button
C
Changes from Rev1.1 to Rev1.2 - Added RP70 and RP71 to Sheet 8 (SM_MA Series ) - Removed 330Ohm Pull-Ups from FLUSH# and TestHi (W35 on 370-Pin Socket) - Added 110Ohm, 1% Pull-Downs to pins S35 and E27 of 370-pin Socket (RTTCTRL and SLEWCTRL) - Changed C347 from a 2200pF Cap to a 0.047uF Cap
Changes from Rev1.2 to Rev1.3 B
- Changed VCCDET Net name to VCOREDET - Changed Value of R125 to 174ohm, 1% (from 178ohm, 1%) - Changed value of C347 back to 2200pF Cap (from 0.047uF Cap) - Designated R126 as No Stuff per SiI 154 Specification - Removed R123 pull-up and connected SiI154 pin 13 to reset. - Changed RP50, RP49, and R169 from 330ohm to 150ohm
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TITLE: INTEL(R) 810 CHIPSET CUSTOMER REFERENCE BOARD
1.3
REVISION HISTORY, PART 5 DRAWN BY: R
PCD PLATFORM DESIGN 1900 PRAIRIE CITY ROAD
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FOLSOM, CALIFORNIA 95630 2
INTEL CORPORATION PLATFORM COMPONENTS DIVISION LAST REVISED:
5-26-1999_17:09 1
PROJECT: INTEL(R) 810 CHIPSET SHEET:
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