Irfz40 5b5q3y
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IRFZ40 IRFZ40FI N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTORS TYPE IRFZ40 IRFZ40FI ■ ■ ■ ■ ■ ■ ■
V DSS
R DS( on)
ID
50 V 50 V
< 0.028 Ω < 0.028 Ω
50 A 27 A
TYPICAL RDS(on) = 0.022 Ω AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA AT 100oC LOW GATE CHARGE HIGH CURRENT CAPABILITY 175oC OPERATING TEMPERATURE
APPLICATIONS ■ HIGH CURRENT, HIGH SPEED SWITCHING ■ SOLENOID AND RELAY DRIVERS ■ REGULATORS ■ DC-DC & DC-AC CONVERTERS ■ MOTOR CONTROL, AUDIO AMPLIFIERS ■ AUTOMOTIVE ENVIRONMENT (INJECTION, ABS, AIR-BAG, LAMPDRIVERS, Etc.)
3 1
3
2
TO-220
1
2
ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS Symbol VD S V DG R V GS
Parameter
Value
Unit
IRFZ40
IRFZ40FI
Drain-source Voltage (V GS = 0)
50
50
V
Drain- gate Voltage (R GS = 20 kΩ)
50
50
V
± 20
Gate-source Voltage
V
ID
Drain Current (cont.) at Tc = 25 oC
50
27
A
ID
o
Drain Current (cont.) at Tc = 100 C
35
19
A
Drain Current (pulsed)
200
200
A
Total Dissipation at Tc = 25 o C
150
45
W
Derating Factor
1
0.3
W/ o C
Insulation Withstand Voltage (DC)
2000
ID M(•) P tot V ISO T stg Tj
Storage Temperature Max. Operating Junction Temperature
V
-65 to 175
o
C
175
o
C
(•) Pulse width limited by safe operating area
July 1993
1/9
IRFZ40/FI THERMAL DATA
R thj-cas e Rthj- amb R th c-s Tl
Thermal Resistance Junction-case
TO-220
ISOWATT220
1
3.33
Max
Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose
o
C/W
62.5 0.5 300
o
C/W C/W o C
Max Value
Unit
o
AVALANCHE CHARACTERISTICS Symbol
Parameter
IA R
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T j max, δ < 1%)
50
A
E AS
Single Pulse Avalanche Energy (starting T j = 25 o C, ID = I AR, VD D = 25 V)
400
mJ
E AR
Repetitive Avalanche Energy (pulse width limited by T j max, δ < 1%)
100
mJ
IA R
Avalanche Current, Repetitive or Not-Repetitive (T c = 100 o C, pulse width limited by T j max, δ < 1%)
35
A
o
ELECTRICAL CHARACTERISTICS (Tcase = 25 C unless otherwise specified) OFF Symbol V( BR)DSS
Parameter Drain-source Breakdown Voltage
Test Conditions I D = 250 µA
VG S = 0
I DS S
Zero Gate Voltage V DS = Max Rating Drain Current (V GS = 0) V DS = Max Rating x 0.8
IG SS
Gate-body Leakage Current (V D S = 0)
Min.
Typ.
Max.
50
Unit V
T c = 125 oC
V GS = ± 20 V
250 1000
µA µA
± 100
nA
ON (∗) Symbol
Parameter
Test Conditions
V G S(th)
Gate Threshold Voltage V DS = V GS
ID = 250 µA
R DS( on)
Static Drain-source On Resistance
V GS = 10V
ID = 29 A
I D( on)
On State Drain Current
V DS > ID( on) x RD S(on) max
VG S = 10 V
Min.
Typ.
Max.
Unit
2
2.9
4
V
0.022
0.028
Ω
50
A
DYNAMIC Symbol gfs (∗) C iss C oss C rss
2/9
Parameter
Test Conditions
Forward Transconductance
V DS > ID( on) x RD S(on) max
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V DS = 25 V
f = 1 MHz
ID = 29 A VG S = 0
Min.
Typ.
17
22 1700 630 200
Max.
Unit S
2200 850 260
pF pF pF
IRFZ40/FI ELECTRICAL CHARACTERISTICS (continued) SWITCHING RESISTIVE LOAD Symbol
Parameter
Test Conditions
t d(on) tr t d(off ) tf
Turn-on Time Rise Time Turn-off Delay Time Fall Time
V DD = 25 V ID = 29 A R G = 4.7 Ω V GS = 10 V (see test circuit)
Qg Q gs Q gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
I D = 64 A V GS = 10 V V DD = Max Rating x 0.8 (see test circuit)
Min.
Typ.
Max.
Unit
50 110 60 25
70 160 90 35
ns ns ns ns
50 15 27
70
nC nC nC
Typ.
Max.
Unit
50 200
A A
SOURCE DRAIN DIODE Symbol
Parameter
IS D I SDM(•)
Source-drain Current Source-drain Current (pulsed)
V S D (∗)
Forward On Voltage
Test Conditions
V GS = 0
Min.
IS D = 50 A
2 V
t rr Q rr
Reverse Recovery Time Reverse Recovery Charge
I SD = 50 A V DD = 30 V
di/dt = 100 A/µs T j = 150 o C
150
ns
0.45
µC
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area
Safe Operating Area for TO-220
Safe Operating Area for ISOWATT220
3/9
IRFZ40/FI
Thermal Impedance for TO-220
Thermal Impedance for ISOWATT220
Derating Curve for TO-220
Derating Curve for ISOWATT220
Output Characteristics
Transfer Characteristics
4/9
IRFZ40/FI
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temperature
Normalized On Resistance vs Temperature
5/9
IRFZ40/FI
Source-drain Diode Forward Characteristics
Unclamped Inductive Load Test Circuit
Unclamped Inductive Waveforms
Switching Time Test Circuit
Gate Charge Test Circuit
6/9
IRFZ40/FI
TO-220 MECHANICAL DATA mm
DIM. MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
L2
16.4
0.645
L4
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
3.5
3.93
0.137
0.154
3.75
3.85
0.147
0.151
D1
C
D
A
E
L9 DIA.
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9 L7 L6
L4
P011C
7/9
IRFZ40/FI
ISOWATT220 MECHANICAL DATA mm
DIM. MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.4
0.7
0.015
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3 L6
F
F1
L7
F2
H
G
G1
Ø
1 2 3 L2
8/9
L4
P011G
IRFZ40/FI
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - - - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
9/9
This datasheet has been from: www.datasheetcatalog.com Datasheets for electronics components.
V DSS
R DS( on)
ID
50 V 50 V
< 0.028 Ω < 0.028 Ω
50 A 27 A
TYPICAL RDS(on) = 0.022 Ω AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA AT 100oC LOW GATE CHARGE HIGH CURRENT CAPABILITY 175oC OPERATING TEMPERATURE
APPLICATIONS ■ HIGH CURRENT, HIGH SPEED SWITCHING ■ SOLENOID AND RELAY DRIVERS ■ REGULATORS ■ DC-DC & DC-AC CONVERTERS ■ MOTOR CONTROL, AUDIO AMPLIFIERS ■ AUTOMOTIVE ENVIRONMENT (INJECTION, ABS, AIR-BAG, LAMPDRIVERS, Etc.)
3 1
3
2
TO-220
1
2
ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS Symbol VD S V DG R V GS
Parameter
Value
Unit
IRFZ40
IRFZ40FI
Drain-source Voltage (V GS = 0)
50
50
V
Drain- gate Voltage (R GS = 20 kΩ)
50
50
V
± 20
Gate-source Voltage
V
ID
Drain Current (cont.) at Tc = 25 oC
50
27
A
ID
o
Drain Current (cont.) at Tc = 100 C
35
19
A
Drain Current (pulsed)
200
200
A
Total Dissipation at Tc = 25 o C
150
45
W
Derating Factor
1
0.3
W/ o C
Insulation Withstand Voltage (DC)
2000
ID M(•) P tot V ISO T stg Tj
Storage Temperature Max. Operating Junction Temperature
V
-65 to 175
o
C
175
o
C
(•) Pulse width limited by safe operating area
July 1993
1/9
IRFZ40/FI THERMAL DATA
R thj-cas e Rthj- amb R th c-s Tl
Thermal Resistance Junction-case
TO-220
ISOWATT220
1
3.33
Max
Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose
o
C/W
62.5 0.5 300
o
C/W C/W o C
Max Value
Unit
o
AVALANCHE CHARACTERISTICS Symbol
Parameter
IA R
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T j max, δ < 1%)
50
A
E AS
Single Pulse Avalanche Energy (starting T j = 25 o C, ID = I AR, VD D = 25 V)
400
mJ
E AR
Repetitive Avalanche Energy (pulse width limited by T j max, δ < 1%)
100
mJ
IA R
Avalanche Current, Repetitive or Not-Repetitive (T c = 100 o C, pulse width limited by T j max, δ < 1%)
35
A
o
ELECTRICAL CHARACTERISTICS (Tcase = 25 C unless otherwise specified) OFF Symbol V( BR)DSS
Parameter Drain-source Breakdown Voltage
Test Conditions I D = 250 µA
VG S = 0
I DS S
Zero Gate Voltage V DS = Max Rating Drain Current (V GS = 0) V DS = Max Rating x 0.8
IG SS
Gate-body Leakage Current (V D S = 0)
Min.
Typ.
Max.
50
Unit V
T c = 125 oC
V GS = ± 20 V
250 1000
µA µA
± 100
nA
ON (∗) Symbol
Parameter
Test Conditions
V G S(th)
Gate Threshold Voltage V DS = V GS
ID = 250 µA
R DS( on)
Static Drain-source On Resistance
V GS = 10V
ID = 29 A
I D( on)
On State Drain Current
V DS > ID( on) x RD S(on) max
VG S = 10 V
Min.
Typ.
Max.
Unit
2
2.9
4
V
0.022
0.028
Ω
50
A
DYNAMIC Symbol gfs (∗) C iss C oss C rss
2/9
Parameter
Test Conditions
Forward Transconductance
V DS > ID( on) x RD S(on) max
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V DS = 25 V
f = 1 MHz
ID = 29 A VG S = 0
Min.
Typ.
17
22 1700 630 200
Max.
Unit S
2200 850 260
pF pF pF
IRFZ40/FI ELECTRICAL CHARACTERISTICS (continued) SWITCHING RESISTIVE LOAD Symbol
Parameter
Test Conditions
t d(on) tr t d(off ) tf
Turn-on Time Rise Time Turn-off Delay Time Fall Time
V DD = 25 V ID = 29 A R G = 4.7 Ω V GS = 10 V (see test circuit)
Qg Q gs Q gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
I D = 64 A V GS = 10 V V DD = Max Rating x 0.8 (see test circuit)
Min.
Typ.
Max.
Unit
50 110 60 25
70 160 90 35
ns ns ns ns
50 15 27
70
nC nC nC
Typ.
Max.
Unit
50 200
A A
SOURCE DRAIN DIODE Symbol
Parameter
IS D I SDM(•)
Source-drain Current Source-drain Current (pulsed)
V S D (∗)
Forward On Voltage
Test Conditions
V GS = 0
Min.
IS D = 50 A
2 V
t rr Q rr
Reverse Recovery Time Reverse Recovery Charge
I SD = 50 A V DD = 30 V
di/dt = 100 A/µs T j = 150 o C
150
ns
0.45
µC
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area
Safe Operating Area for TO-220
Safe Operating Area for ISOWATT220
3/9
IRFZ40/FI
Thermal Impedance for TO-220
Thermal Impedance for ISOWATT220
Derating Curve for TO-220
Derating Curve for ISOWATT220
Output Characteristics
Transfer Characteristics
4/9
IRFZ40/FI
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temperature
Normalized On Resistance vs Temperature
5/9
IRFZ40/FI
Source-drain Diode Forward Characteristics
Unclamped Inductive Load Test Circuit
Unclamped Inductive Waveforms
Switching Time Test Circuit
Gate Charge Test Circuit
6/9
IRFZ40/FI
TO-220 MECHANICAL DATA mm
DIM. MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
L2
16.4
0.645
L4
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
3.5
3.93
0.137
0.154
3.75
3.85
0.147
0.151
D1
C
D
A
E
L9 DIA.
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9 L7 L6
L4
P011C
7/9
IRFZ40/FI
ISOWATT220 MECHANICAL DATA mm
DIM. MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.4
0.7
0.015
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3 L6
F
F1
L7
F2
H
G
G1
Ø
1 2 3 L2
8/9
L4
P011G
IRFZ40/FI
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - - - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
9/9
This datasheet has been from: www.datasheetcatalog.com Datasheets for electronics components.
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